At Aites Co., Ltd., we provide a wide range of technical services for evaluation tests of printed circuit boards (mounted boards) equipped with electronic components. We conduct reliability tests, solder joint observations, whisker observations, and cross-sectional observations. We have IPC-A-610 certified IPC specialists on staff who can assist with observations in accordance with international standards, consultations, and various observation-related concerns. Additionally, we offer services such as X-ray observations, appearance inspections, and shape measurements, so please feel free to consult with us when needed.

We will introduce an example of analyzing organic-inorganic composite materials using FT-IR and SEM-EDX. FT-IR measurements were conducted on the glossy and non-glossy areas of a PET bottle label, and the IR spectra differed between the glossy and non-glossy areas. Since the non-glossy area resembles the spectrum of acrylic resin, it is considered that the main component is acrylic resin. Additionally, SEM-EDX measurements were performed on both the glossy and non-glossy areas, and EDX spectra and backscattered electron images were obtained, revealing that the non-glossy area contained sulfur (S) and barium (Ba), which were not detected in the glossy area.

This presentation introduces the composition analysis of active materials in cathode materials using ICP emission analysis. The cathode material in lithium-ion batteries (LIB) is one of the important components that influence the battery's voltage and energy density, and the composition of the cathode material significantly affects the battery's performance. ICP emission analysis allows for qualitative and quantitative analysis of approximately 70 elements, primarily metal elements. In addition to composition analysis of LIB cathode materials, it can also be applied to various analyses, including qualitative and quantitative analysis of additives and impurities contained in samples, as well as quantitative analysis of substances regulated by the RoHS directive.

We offer the "CP Processing Device Arblade5000_Wide Area Cross-Section Milling." The "Arblade5000" enables extensive processing by combining a high milling rate with wide area cross-section milling capabilities. With the wide area cross-section milling holder, the cross-section milling width can be expanded up to 10mm, making it effective for electronic components that require wide area milling. 【Features】 ■ Approximately double the width of processing is possible ■ The previously localized observation range can be significantly expanded ■ Equipped with a cooling temperature adjustment function to control temperature rise caused by ion beam irradiation ■ The observable range is approximately 8mm

Our company conducts "IOL testing of discrete semiconductors." We repeatedly turn the power ON/OFF in a room temperature environment, applying stress to the device due to temperature changes caused by the device's own heat generation during power ON. During power OFF (cooling), forced cooling is also performed using a fan. Additionally, before conducting the tests, we use representative samples to make adjustments to reach the test temperature conditions. It is possible to adjust the current/time during heating and the fan capacity/timing during cooling.

We would like to inform you that we have moved from our previous headquarters in Yasu and our Ritto office to the following new location. Taking this opportunity, we are committed to further developing our business and making every effort to meet your expectations. We kindly ask for your continued support and goodwill. 【New Headquarters Location】 ■ Address: 1-60 Kuribayashi-cho, Otsu City, Shiga Prefecture ■ Phone: 077-599-5015 ■ FAX: 077-544-7710 * The phone numbers for each department remain the same as before. Operations, phone, and fax services at the old location have been discontinued as of August 10 (Wednesday). We apologize for any inconvenience this may cause and appreciate your understanding.