Information about the CP processing device Arblade5000_Wide Area Cross-section Milling

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We offer the "CP Processing Device Arblade5000_Wide Area Cross-Section Milling." The "Arblade5000" enables extensive processing by combining a high milling rate with wide area cross-section milling capabilities. With the wide area cross-section milling holder, the cross-section milling width can be expanded up to 10mm, making it effective for electronic components that require wide area milling. 【Features】 ■ Approximately double the width of processing is possible ■ The previously localized observation range can be significantly expanded ■ Equipped with a cooling temperature adjustment function to control temperature rise caused by ion beam irradiation ■ The observable range is approximately 8mm

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CP processing device Arblade5000_wide area cross-section milling
It is possible to process with approximately twice the width! This significantly expands the previously localized observation range.

【Arblade5000 Specifications】 ■ Maximum milling rate (material Si): 1mm/h or more ■ Maximum sample size: 20(W)×12(D)×7(H)mm ■ Processing width: 8mm ■ Cooling temperature setting range: 0℃ to -100℃ *For more details, please download the PDF or feel free to contact us.
Analysis of the assembly joints of the implemented components
By applying chemical etching, ion milling, and FIB processing to mechanical polishing, we will analyze various metal joints, starting with lead-free solder.

■Mechanical polishing of the substrate bonding area + Chemical etching + Ion milling Observation using optical microscope and SEM ■Cross-section creation using FIB Observation using SEM
Total support service for cross-sectional grinding, processing, observation, and analysis.
We undertake contract processing and manufacturing of cross-sections of various parts and materials.

For more details, please refer to the PDF document or feel free to contact us.
Cross-section polishing (CP) method for cross-sectional observation service.
Achieve high processing precision and a wide processing area! Machining is also possible while reducing damage with cooling functions.

【Device Specifications】 ■ Triple Ion Milling Device with Cooling Function - Maximum Sample Size: 50×50×10mm - Maximum Processing Width: 4mm - Pinpoint Position Accuracy: 10–20μm - Cooling Function: Down to -150℃ *For more details, please refer to the PDF document or feel free to contact us.
Introduction to Cross-Section Processing and Observation Methods
Mechanical grinding allows for a wide range of processing and observation! We will propose appropriate processing and observation methods or combinations.

For more details, please refer to the PDF document or feel free to contact us.