Introduction to Cross-Section Processing and Observation Methods
Mechanical grinding allows for a wide range of processing and observation! We will propose appropriate processing and observation methods or combinations.
We will introduce sample processing using mechanical polishing and mechanical polishing combined with ion milling treatment. Mechanical polishing is a common and long-established method for creating cross-sections, allowing for a wide range of cross-sectional production. Additionally, by combining it with ion milling treatment, it is possible to create observation surfaces comparable to those produced by CP processing. At Aites, we propose appropriate processing and observation methods or combinations based on our accumulated know-how. Please feel free to contact us for consultations or inquiries. 【Features】 ■ Mechanical polishing allows for extensive processing and observation. ■ By repeating mechanical polishing and imaging, three-dimensional observation is possible. ■ Observation at any desired location can be performed based on the constructed 3D image. ■ After mechanical polishing, depending on the sample, observation comparable to that of CP processed samples is possible. *For more details, please refer to the PDF materials or feel free to contact us.
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About the curing temperature of epoxy resin free from hazardous substances.
We conducted measurements to reconfirm the temperature of heat generation during curing, following the change to a non-toxic epoxy resin. When using a large amount of resin, we apply heat generation prevention treatment for resin embedding. Without this treatment, the temperature can rise up to 138°C during curing. However, by applying the heat generation prevention treatment even with a large amount of resin, we were able to keep the heat generation during curing within 30°C.
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Information about the CP processing device Arblade5000_Wide Area Cross-section Milling
We offer the "CP Processing Device Arblade5000_Wide Area Cross-Section Milling." The "Arblade5000" enables extensive processing by combining a high milling rate with wide area cross-section milling capabilities. With the wide area cross-section milling holder, the cross-section milling width can be expanded up to 10mm, making it effective for electronic components that require wide area milling. 【Features】 ■ Approximately double the width of processing is possible ■ The previously localized observation range can be significantly expanded ■ Equipped with a cooling temperature adjustment function to control temperature rise caused by ion beam irradiation ■ The observable range is approximately 8mm
