アイテス Official site

IPC-A-610 certified IPC specialists are available! Assistance with observations in accordance with international standards.

For more details, please download the PDF or feel free to contact us.

We provide quick and accurate solutions based on technology and experience for quality initiatives that consider performance, reliability, disposal, and recycling from the product planning stage.

We provide speedy and accurate solutions to quality issues that arise in every phase, from planning, design, and development of electronic components to mass production and after shipment, based on our long-cultivated technology and experience.

By applying chemical etching, ion milling, and FIB processing to mechanical polishing, we will analyze various metal joints, starting with lead-free solder.

■Mechanical polishing of the substrate bonding area + Chemical etching + Ion milling Observation using optical microscope and SEM ■Cross-section creation using FIB Observation using SEM

We conduct reliability evaluation tests for various electronics products, components, and materials in accordance with standard specifications such as JIS, JEDEC, and MIL.

■ Highly Accelerated Life Test Internal dimensions (maximum) Φ545×L550mm Temperature and humidity range +105～162.2℃/75～100%RH ■ Thermal Shock Test Internal dimensions (maximum) W970×H460×D670mm Temperature range -65℃～0℃/+60℃～200℃ ■ Constant Temperature and Humidity Test Internal dimensions (maximum) W1000×H1000×D720mm Temperature and humidity range -70℃～+150℃/20～98%RH ■ Liquid Bath Thermal Shock Test Sample basket (maximum) W320×H240×D320mm Load capacity (maximum) 10kg Temperature range -65℃～0℃/+60℃～150℃

We conduct environmental testing, as well as non-destructive observation and electrical property measurements.

For more details, please refer to the PDF document or feel free to contact us.

Each part is carefully polished by hand, using an efficient process without waste!

For more details, please refer to the PDF document or feel free to contact us.

You can closely observe the solder joint condition of electronic components on the implementation board and the internal structure of the components!

For more details, please refer to the PDF document or feel free to contact us.

The inspector observes without missing anything! Consistent whisker evaluation is possible from reliability testing to analysis.

For more details, please refer to the PDF document or feel free to contact us.

Support from reliability testing observations to 3D measurement! It is possible to conduct whisker evaluations while eliminating transportation risks.

【Service Flow】 ■Reliability Testing (Elimination of Transport Risks) ■Occurrence Frequency Observation (Double-check to avoid oversight) ■Photography ■3D Measurement ■Reporting *For more details, please refer to the PDF document or feel free to contact us.

Introducing a test that allows for the observation of fracture and delamination layers by permeating coloring liquids and fluorescent liquids!

【Case Study】 ■BGA: Solder balls on the substrate side - As a result of observation, many solder balls fractured on the component side, progressing from the outer circumference of the ball. ■QFP: Solder joint on the substrate side - As a result of observation, the fracture progressed from the fillet heel of the lead joint. *For more details, please refer to the PDF document or feel free to contact us.

Calculating the crack rate of ball joints and implementing it according to customer specifications!

For more details, please refer to the PDF document or feel free to contact us.

Not only the joints of electronic components, but also the evaluation of fixed parts such as screws!

【Examples of Thermal Shock Test Standards】 ■JESD 22-A104 TEMPERATURE CYCLING ■IEC 60749-25 Temperature cycle ■EIAJ ED-4701/100 method 105 Temperature cycle ■MIL STD-883 1010.8 TEMPERATURE CYCLING ■Other various test standards are specified *For more details, please refer to the PDF document or feel free to contact us.

Supports high temperatures up to 180℃! Effective for testing and evaluating automotive and high-temperature electronic components and other heat-resistant parts.

【Device Specifications】 ■Temperature Range 　・Low Temperature Side: -40℃ to 0℃ 　・High Temperature Side: 60℃ to 180℃ 　・Working Fluid: Galden D03 ■Sample Basket Size 　・Internal Dimensions: W190mm × H240mm × D360mm 　・Load Capacity: 10Kg *For more details, please refer to the PDF document or feel free to contact us.

Observations before and after reliability testing and cross-sectional observations! Here are examples of observations of various implemented components.

For more details, please refer to the PDF document or feel free to contact us.

Introducing the "Observation Mode" of a chip capacitor (MLCC) under a microscope!

For more details, please refer to the PDF document or feel free to contact us.