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Ink immersion test for implemented parts (dye and pry)

Introducing a test that allows for the observation of fracture and delamination layers by permeating coloring liquids and fluorescent liquids!

We would like to introduce our "Dye and Pry Test for Embedded Components." For confirming the breakage and delamination of packages and embedded components, there are non-destructive testing methods (such as transmission X-ray and CT) and cross-sectional observation. However, these methods make it difficult to capture the spread of delamination in the "plane" of the broken layers. In the Dye and Pry Test, by permeating a colored or fluorescent liquid, we can observe the broken and delaminated layers. Please feel free to contact us if you have any inquiries. 【Flow of the Dye and Pry Test】 ■ Dye immersion ■ Pry ■ Observation using optical microscopy or SEM *For more details, please refer to the PDF document or feel free to contact us.

Related Link - http://www.ites.co.jp/analyze/index.html

basic information

【Case Study】 ■BGA: Solder balls on the substrate side - As a result of observation, many solder balls fractured on the component side, progressing from the outer circumference of the ball. ■QFP: Solder joint on the substrate side - As a result of observation, the fracture progressed from the fillet heel of the lead joint. *For more details, please refer to the PDF document or feel free to contact us.

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Applications/Examples of results

For more details, please refer to the PDF document or feel free to contact us.

X-ray fluoroscopy and CT examination device: Case study of BGA solder crack analysis

TECHNICAL

Crystal analysis by EBSD BGA

PRODUCT

Crystal analysis by EBSD: Intermetallic compounds in solder joints

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Cross-sectional polishing service for implementation parts and electronic components.

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Surface mount electronic component cross-sectional observation service

PRODUCT

Appearance observation using a digital microscope.

TECHNICAL

Ink immersion test for implementation parts (dye and pry)

OTHER

Measurement of solder crack rate by cross-sectional observation.

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Evaluation of various implementation boards

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Aites was established in 1993, originating from the quality assurance department of the IBM Japan Yasu office. Based on the technical expertise cultivated through cutting-edge defect analysis and reliability assurance of electronic components at the IBM Japan Yasu office, we have provided various products and services that support the development and manufacturing of semiconductors, displays, organic EL, solar cells, and electronic components to customers both domestically and internationally.