Thermal shock test
Not only the joints of electronic components, but also the evaluation of fixed parts such as screws!
At AITES Co., Ltd., we conduct "Thermal Shock Testing." By repeatedly exposing samples to high and low temperatures, not only does stress occur due to thermal effects, but also due to the expansion and contraction of various parts. Repeated stress also adds to the overall stress. This test is conducted not only for the joints of electronic components but also for evaluating fixed points such as screws. 【Main Specifications of the Thermal Shock Testing Equipment】 ■ Internal dimensions: W650×H460×D370mm, Temperature range: -65 to 0/+60 to 200℃ ■ Internal dimensions: W650×H460×D670mm, Temperature range: -65 to 0/+60 to 200℃ ■ Internal dimensions: W970×H460×D670mm, Temperature range: -65 to 0/+60 to 200℃ *For more details, please refer to the PDF document or feel free to contact us.
basic information
【Examples of Thermal Shock Test Standards】 ■JESD 22-A104 TEMPERATURE CYCLING ■IEC 60749-25 Temperature cycle ■EIAJ ED-4701/100 method 105 Temperature cycle ■MIL STD-883 1010.8 TEMPERATURE CYCLING ■Other various test standards are specified *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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Evaluation of various implementation substrates
At Aites Co., Ltd., we provide a wide range of technical services for evaluation tests of printed circuit boards (mounted boards) equipped with electronic components. We conduct reliability tests, solder joint observations, whisker observations, and cross-sectional observations. We have IPC-A-610 certified IPC specialists on staff who can assist with observations in accordance with international standards, consultations, and various observation-related concerns. Additionally, we offer services such as X-ray observations, appearance inspections, and shape measurements, so please feel free to consult with us when needed.
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Strain measurement in thermal shock testing.
We would like to introduce the "strain measurement in thermal shock testing" conducted by our company. A sample with strain gauges attached was set up in the thermal shock testing device, and the wiring of the strain gauges was connected to an external data logger to record strain data in real time during the test. For two types of copper-clad laminates, the strain behavior during the thermal shock test was observed, and it was noted that significant strain occurred with changes in temperature. It was found that FR-1 exhibited greater strain compared to FR-4.
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Aites was established in 1993, originating from the quality assurance department of the IBM Japan Yasu office. Based on the technical expertise cultivated through cutting-edge defect analysis and reliability assurance of electronic components at the IBM Japan Yasu office, we have provided various products and services that support the development and manufacturing of semiconductors, displays, organic EL, solar cells, and electronic components to customers both domestically and internationally.