Cross-sectional observation of substrate-mounted components.

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We will introduce examples of cross-sectional observations of various components mounted on a board called an organic substrate. Inside various electronic devices around us, there are substrates equipped with electronic components. When observing the mounted substrate, you can see that numerous components are tightly soldered together. It is necessary to verify that these components are properly joined, as they will not function correctly otherwise. Please contact us if you are considering observations before and after reliability testing or cross-sectional observations.

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Cross-sectional observation of substrate-mounted components.
Observations before and after reliability testing and cross-sectional observations! Here are examples of observations of various implemented components.

For more details, please refer to the PDF document or feel free to contact us.
Analysis of the assembly joints of the implemented components
By applying chemical etching, ion milling, and FIB processing to mechanical polishing, we will analyze various metal joints, starting with lead-free solder.

■Mechanical polishing of the substrate bonding area + Chemical etching + Ion milling Observation using optical microscope and SEM ■Cross-section creation using FIB Observation using SEM
Total support service for cross-sectional grinding, processing, observation, and analysis.
We undertake contract processing and manufacturing of cross-sections of various parts and materials.

For more details, please refer to the PDF document or feel free to contact us.
The state of analysis techniques, including defect analysis of joints, adhesion, and assembly parts.
Introducing the perspectives from which analysis and analytical techniques should be advanced!

For more details, please refer to the PDF document or feel free to contact us.
Cross-sectional polishing service for implementation parts and electronic components.
Each part is carefully polished by hand, using an efficient process without waste!

For more details, please refer to the PDF document or feel free to contact us.
Surface mount electronic component cross-sectional observation service
You can closely observe the solder joint condition of electronic components on the implementation board and the internal structure of the components!

For more details, please refer to the PDF document or feel free to contact us.
Observation of cross-sectional processing of CCD camera module.
With our advanced technology, we can also create cross-sections of highly challenging samples!

For more details, please refer to the PDF document or feel free to contact us.
Observation of aluminum welding joints
Introducing examples of aluminum welding observation. Internal observation through X-ray fluoroscopy and CT inspection allows for clearer observation after cross-section preparation!

For more details, please refer to the PDF document or feel free to contact us.
Cross-sectional observation of large samples (expansion valve)
Introducing a case study on the cross-section preparation of a large sample (65mm × 28mm) and the observation of its internal structure!

For more details, please refer to the PDF document or feel free to contact us.
Measurement of solder crack rate by cross-sectional observation.
Calculating the crack rate of ball joints and implementing it according to customer specifications!

For more details, please refer to the PDF document or feel free to contact us.
Observation of Pb-free solder cross-section after reliability testing.
Three types of Pb-free soldered products were subjected to reliability testing! We will introduce the main objectives of each test and the results of cross-sectional observations.

**Main Objectives and Cross-Section Observation Results of Each Test** (1) TC Test: A test to confirm fatigue failure of solder due to thermomechanical load - Solder cracks have occurred - Growth of intermetallic compound layer is observed (2) HT Test: A test to confirm high-temperature durability and solder connectivity - No solder cracks have occurred - Significant growth of intermetallic compound layer is observed (3) TH Test: A test to confirm moisture resistance - No solder cracks have occurred - Humidity has little effect on the growth of intermetallic compound layer *For more details, please refer to the PDF document or feel free to contact us.*