Observation of Pb-free solder cross-section after reliability testing.
Three types of Pb-free soldered products were subjected to reliability testing! We will introduce the main objectives of each test and the results of cross-sectional observations.
We would like to introduce the cross-sectional observation of Pb-free solder after reliability testing conducted by our company. Pb-free solder assemblies (Sn/Ag/Cu alloy solder) were subjected to three types of reliability tests. We compared the initial products with those after testing to check for the presence of cracks and the growth of intermetallic compound layers. To gradually confirm the durability of the solder joints through observations of crack progression, we recommend the TC test, which allows for cross-sectional observation after extraction at each cycle. 【Test Conditions】 (1) TC Test (Temperature Cycle) 125℃ for 20 minutes / -40℃ for 20 minutes / 1000 cycles (2) HT Test (High-Temperature Storage) 150℃ for 1000 hours (3) TH Test (Temperature and Humidity) 85℃ / 85% RH for 1000 hours *For more details, please refer to the PDF document or feel free to contact us.
basic information
**Main Objectives and Cross-Section Observation Results of Each Test** (1) TC Test: A test to confirm fatigue failure of solder due to thermomechanical load - Solder cracks have occurred - Growth of intermetallic compound layer is observed (2) HT Test: A test to confirm high-temperature durability and solder connectivity - No solder cracks have occurred - Significant growth of intermetallic compound layer is observed (3) TH Test: A test to confirm moisture resistance - No solder cracks have occurred - Humidity has little effect on the growth of intermetallic compound layer *For more details, please refer to the PDF document or feel free to contact us.*
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For more details, please refer to the PDF document or feel free to contact us.
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Cross-sectional observation of substrate-mounted components (1) to (6)
We would like to introduce an example of cross-sectional observation of mounted components conducted by our company. Using commercially available computer circuit boards, we observed the solder joints of mounted components and the internal structure of the components with a metal microscope. The observation modes of the metal microscope include bright field observation, dark field observation, and polarized light observation, among others. Additionally, there are observations using transmitted light, and the observation mode is selected according to the sample. By conducting cross-sectional observations before and after reliability testing, we can evaluate the reliability of the product. When observing, it is important to select an appropriate "observation mode" to clearly capture the condition of the solder joint interface and defects such as cracks.
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Cross-sectional observation of substrate-mounted components.
We will introduce examples of cross-sectional observations of various components mounted on a board called an organic substrate. Inside various electronic devices around us, there are substrates equipped with electronic components. When observing the mounted substrate, you can see that numerous components are tightly soldered together. It is necessary to verify that these components are properly joined, as they will not function correctly otherwise. Please contact us if you are considering observations before and after reliability testing or cross-sectional observations.
