Total support service for LED.
We will thoroughly evaluate and verify the LED from all angles.
■Comprehensive Capability Consistent evaluation resistance from reliability testing to electrical characteristic measurement, optical characteristic measurement, and further analysis. ■Rich Analytical Methods - Forward bias analysis / Reverse bias analysis - Detection from visible to infrared - Emission analysis / OBIRCH analysis ■Special Technology By filtering the visible light range, we can detect weak emissions from abnormal areas without missing them.
basic information
■LED Reliability Testing ・Optical Property Evaluation - Corresponding to Ultraviolet and Visible Light Regions - The optical property values of LED products can be utilized for product inspection and understanding quality status. ・Electrical Property Evaluation Understanding the electrical defects or degradation state of the LED. ・High-Temperature Operation Testing / High-Temperature and High-Humidity Operation Testing Voltage monitoring during testing operations is possible using In-Situ continuous measurement devices. ・Reliability Testing Conducting reliability testing evaluations considering the usage environment of the LED. ・Lighting Test Testing can be conducted from individual LED devices to 1200mm fluorescent tube sizes. ・Non-Destructive Testing Conducting transmission observation of the internal structure of the LED using X-rays. ・ESD Testing Two types: HBM (Human Body Model) and MM (Machine Model). ■LED Analysis and Evaluation ・Isolation of LED Failure Modes Identifying defective areas and proposing optimal analysis methods. ・Emission Analysis with Forward and Reverse Bias Detecting leakage points of the LED using various methods. ・Back Surface Polishing and Emission Analysis of LED Elements Analyzing the cause of leakage occurrence through cross-sectional observation of leakage points. ・Structural Analysis Example of Orange LEDs Analyzing the structure through cross-sectional SEM observation.
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Applications/Examples of results
Structural analysis of orange LED.
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In-chamber imaging during constant temperature and humidity testing.
Our company conducts environmental testing using a constant temperature and humidity chamber with a front glass window and a camera, allowing us to capture and monitor the operational status, such as screen displays, during the tests. During environmental testing using equipment like constant temperature and humidity chambers, monitoring the condition of the test subjects with loggers (for voltage, current, resistance, temperature, etc.) is widely practiced. However, monitoring the operational status of equipment during testing can be difficult unless the test equipment is equipped with dedicated external outputs. For samples where monitoring with loggers is challenging, we combine a constant temperature and humidity chamber with a front glass window option, a camera, and monitoring software to conduct environmental tests while capturing and monitoring the condition of the test equipment.
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Examples of semiconductor observation using mechanical polishing.
In the methods for cross-section preparation in semiconductor structure observation and defect analysis, CP, FIB, and mechanical polishing are mentioned, each having its own advantages and disadvantages, making it necessary to consider which method to use. In recent years, CP and FIB have become more common, and it seems that the use of mechanically polished methods, which require technical skill, is decreasing. However, it is still not something to be dismissed. While there are merits and demerits, it is possible to achieve cross-section preparation with mechanical polishing that is on par with FIB and CP. At our company, based on years of accumulated know-how, we propose the most appropriate processing method according to the observation purpose, sample composition, and structure.
