Crystal analysis by EBSD: Aluminum weld joint (spot welding)
We will introduce an analysis example confirming that the welded area has a large distribution of grain crystals.
As a case study of EBSD, we conducted an analysis of the cross-section of an aluminum welding joint from the cross-sectional direction, which I would like to introduce. For a sample where an aluminum plate was spot welded to an aluminum case, we prepared a cross-section of the weld and performed EBSD analysis. In the distribution of grain sizes, it was confirmed that the weld area has a greater number of larger grains compared to the base material. [Analysis Overview] ■ Visualization of Grain Structure - It is evident that the shape and size of the grains in the weld area differ from those in the base material. ■ Distribution of Grain Sizes - It can be confirmed that the weld area has a greater distribution of larger grains compared to the base material. *For more details, please refer to the PDF document or feel free to contact us.
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Example of analysis of compounds at the SAC solder and Ni pad interface.
We will introduce an example of the analysis of compounds formed at the interface between Sn-Ag-Cu solder and NiP pads. At the interface of NiP pads and Sn-Ag-Cu solder, compounds such as (Ni,Cu)3Sn4 and (Cu,Ni)6Sn5 grow, and surface analysis using EDX shows the distribution of Ni, Cu, and Sn within these compounds. The EBSD method is a technique that analyzes based on the crystallographic information of the sample. By combining it with elemental analysis using EDX, it is possible to estimate the composition, and in some cases, it may be possible to analyze using crystallographic data for Ni3Sn4 and Cu6Sn5 as substitutes.
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Observation of metallic tissue through chemical treatment.
We will introduce the observation of metallic structures through chemical treatment. By performing chemical treatment on metallic samples, it is possible to clearly observe the metallic structure. Observing the structure can reveal the condition of the sample and the history of applied heat and stress, providing clues about the quality of the product and any defects based on the structure's shape. In the catalog, you can find details on the observation of metallic structures, such as the macrostructure of aluminum plates and the soldered parts of copper terminals. Additionally, we offer other services such as cross-sectional observation and various analysis services. Please feel free to contact us if you have any requests.
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Aites was established in 1993, originating from the quality assurance department of the IBM Japan Yasu office. Based on the technical expertise cultivated through cutting-edge defect analysis and reliability assurance of electronic components at the IBM Japan Yasu office, we have provided various products and services that support the development and manufacturing of semiconductors, displays, organic EL, solar cells, and electronic components to customers both domestically and internationally.