Detection sensitivity due to differences in acceleration voltage during SEM-EDX analysis.
Appropriate acceleration conditions for accurate analysis results! The detection depth of EDX changes with differences in acceleration voltage!
This presentation introduces the detection sensitivity related to differences in acceleration voltage during SEM-EDX analysis. When analyzing the gold-plated surface of a typical printed circuit board (PCB), there are instances where the underlying nickel is detected even though it is not exposed. This is related to the scattering depth of the electron beam, and it is essential to set appropriate acceleration conditions to obtain accurate analysis results. In this study, we conducted an examination of the EDX detection depth based on differences in acceleration voltage using Monte Carlo simulations. This is just one example, but it is important to consider how electrons scatter while setting the acceleration voltage to achieve accurate analysis results. [Test Board Overview] - The sample used is a gold-plated pad from a typical printed circuit board (PCB). - The layer structure consists of nickel plating and gold plating on copper wiring. - The thickness of the gold plating, as observed in cross-section, is 212 nm. *For more details, please refer to the PDF document or feel free to contact us.*
basic information
【EDX Analysis Results】 - At an acceleration voltage of 10kV, Ni in the Au plating underlayer was not detected, but at an acceleration voltage of 12kV or higher, the underlayer Ni was detected. - The reason why the underlayer information can be detected by increasing the acceleration voltage was confirmed through Monte Carlo simulation. *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
