アイテス Official site

Identification of failure locations in electronic components through thermal analysis.

It is possible to perform non-destructive testing from fault location identification to internal observation! High-precision identification of heat generation areas can be achieved.

Thermal analysis is a method for identifying defective areas by detecting heat generated at leak points due to applied voltage using a high-sensitivity InSb camera. By detecting the weak heat generated from shorts and leaks with a high-sensitivity InSb camera, it is possible to non-destructively identify the failure points of electronic components such as semiconductors. Furthermore, non-destructive observation can also be performed using X-ray inspection equipment. 【Features】 ■ Identifying defective areas by detecting heat generated at leak points with a high-sensitivity InSb camera ■ Analyzing samples in a non-destructive state, and also capable of analyzing electronic components that are difficult to analyze with OBIRCH or emission methods ■ Using the lock-in function to acquire phase information allows for high-precision identification of heat generation points *For more details, please refer to the PDF document or feel free to contact us.

Related Link - https://www.ites.co.jp/structure/furyo.html

basic information

【Device Specifications】 ■Observation field size: 9.5x7.5mm to 1.2x0.96mm ■Detection wavelength range: 3.7μm to 5.1μm ■Maximum applied voltage, current: 1.5kV/120mA 3kV/20mA ■Lock-in frequency: 0.1Hz to 83Hz *For more details, please refer to the PDF document or feel free to contact us.

Price range

Delivery Time

Applications/Examples of results

For more details, please refer to the PDF document or feel free to contact us.

Identification of failure points in electronic components through thermal analysis.

PRODUCT

[Case Study] X-ray Fluoroscopy and CT Examination Equipment

TECHNICAL

Power semiconductor analysis service

PRODUCT

MLCC crack X-ray observation

TECHNICAL

X-ray fluoroscopy and CT examination device: Observation case of chip resistors

TECHNICAL

X-ray fluoroscopy and CT examination device: Case of LED malfunction observation (X-ray fluoroscopy observation)

TECHNICAL

X-ray fluoroscopy and CT scanner 'Cheetah EVO'

PRODUCT

Failure analysis of power devices

PRODUCT

Case study of failure analysis of oxide-based all-solid-state batteries.

TECHNICAL

News about this product(1)

Recommended products

Distributors

Aites was established in 1993, originating from the quality assurance department of the IBM Japan Yasu office. Based on the technical expertise cultivated through cutting-edge defect analysis and reliability assurance of electronic components at the IBM Japan Yasu office, we have provided various products and services that support the development and manufacturing of semiconductors, displays, organic EL, solar cells, and electronic components to customers both domestically and internationally.