Identification of failure locations in electronic components through thermal analysis.
It is possible to perform non-destructive testing from fault location identification to internal observation! High-precision identification of heat generation areas can be achieved.
Thermal analysis is a method for identifying defective areas by detecting heat generated at leak points due to applied voltage using a high-sensitivity InSb camera. By detecting the weak heat generated from shorts and leaks with a high-sensitivity InSb camera, it is possible to non-destructively identify the failure points of electronic components such as semiconductors. Furthermore, non-destructive observation can also be performed using X-ray inspection equipment. 【Features】 ■ Identifying defective areas by detecting heat generated at leak points with a high-sensitivity InSb camera ■ Analyzing samples in a non-destructive state, and also capable of analyzing electronic components that are difficult to analyze with OBIRCH or emission methods ■ Using the lock-in function to acquire phase information allows for high-precision identification of heat generation points *For more details, please refer to the PDF document or feel free to contact us.
basic information
【Device Specifications】 ■Observation field size: 9.5x7.5mm to 1.2x0.96mm ■Detection wavelength range: 3.7μm to 5.1μm ■Maximum applied voltage, current: 1.5kV/120mA 3kV/20mA ■Lock-in frequency: 0.1Hz to 83Hz *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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