Ultrasonic Microscope 'SAM'
Non-destructive observation is possible! It is effective in detecting defects in internal conditions and adhesion states!
We would like to introduce our ultrasonic microscope, the SAM (Scanning Acoustic Microscope). It is highly effective in detecting defects in the internal conditions and adhesion states of semiconductor packages, substrates, and electronic components. Observation can be performed non-destructively, and defects such as delamination can be detected from the reflected waves of the ultrasonic waves incident on the sample. 【Specifications (excerpt)】 ■ Pulse Receiver: 500MHz ■ Observation Methods: Compatible with both reflection and transmission methods ■ Acoustic Lenses / Reflection Method: 15, 25, 30, 50, 80, 100, 230MHz ■ Acoustic Lenses / Transmission Method: 15, 25, 30, 50, 100MHz *For more details, please refer to the PDF document or feel free to contact us.
basic information
【Other Specifications】 ■Maximum Measurement Range: 314mm × 314mm Minimum Pitch: 0.5μm ■Number of Images Acquired (1 Scan): 100 images (Gate) *For more details, please refer to the PDF document or feel free to contact us.
Price range
Delivery Time
Applications/Examples of results
【Applications】 ■ Semiconductor packages, substrates, electronic components: delamination at bonding interfaces, cracks, bump bonding ■ Resin, ceramics, metal materials: delamination, cracks, voids ■ Adhesive materials: adhesion observation, filling observation ■ Bonded wafers: voids, adhesion observation *For more details, please refer to the PDF document or feel free to contact us.
