Solder Heat Resistance Test (SMD)
Reproducing temperature stress during transportation! Evaluating the presence or absence of delamination and cracks through heat treatment.
Our company conducts a "Solder Heat Resistance Test (SMD)" to evaluate the heat resistance of surface mount devices (SMD) during the soldering process. We replicate moisture absorption prior to mounting through humidification treatment and assess the presence of delamination or cracks through heating treatment that corresponds to the thermal stress during soldering. As part of the post-test inspection, we perform the same inspection as the initial measurement, and if necessary, we also conduct analyses such as cross-sectional observation of defective areas. 【Flow of Solder Heat Resistance Test】 ■ Initial Measurement ■ Temperature Cycle (shipping condition) ■ Drying Treatment (Baking) ■ Humidification Treatment (Soaking) ■ Heating Treatment (Reflow) ■ Final Measurement *For more details, please refer to the PDF document or feel free to contact us.
basic information
【Pre-examination Inspection】 ■Electrical Characteristics ■Visual Inspection ■X-ray Observation ■Ultrasonic Microscope Observation, etc. *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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Aites was established in 1993, originating from the quality assurance department of the IBM Japan Yasu office. Based on the technical expertise cultivated through cutting-edge defect analysis and reliability assurance of electronic components at the IBM Japan Yasu office, we have provided various products and services that support the development and manufacturing of semiconductors, displays, organic EL, solar cells, and electronic components to customers both domestically and internationally.