The Relationship Between Materials and Heat: An Introduction to Thermal Analysis
It is also possible to estimate the relationship with molecular-level structures! Introducing the types of thermal analysis and the properties that can be understood.
When heat is applied to materials, various properties change. Thermal analysis is suitable for investigating such properties. Depending on the changes in the properties we want to observe, we use different devices and combine them as necessary. By understanding the various changes that occur when materials are subjected to heat, we can gain insights into how they will behave in practical applications. When combined with other chemical analyses, it is also possible to estimate the relationship with molecular-level structures. If you have any questions about the relationship between materials and heat, please feel free to consult us. 【Analysis Equipment (Excerpt)】 <DSC (Differential Scanning Calorimeter)> ■ Changes observed: Heat flow (exothermic/endothermic) ■ Properties that can be determined: Melting point (freezing point), glass transition, crystallization, specific heat capacity ■ Applicable materials: Plastics, rubber, metals ■ Analysis examples: Measurement of the curing degree of thermosetting resins, measurement of the transformation temperature of shape memory alloys *For more details, please refer to the PDF document or feel free to contact us.
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【Other Analysis Devices (Excerpt)】 <TG-DTA (Thermogravimetric Differential Thermal Analysis Device)> ■ Observed Changes: Temperature difference, weight change (cf: Ref) ■ Characteristics that can be determined: Thermal decomposition, oxidation, dehydration ■ Applicable Materials: Plastics, rubber, ceramics ■ Analysis Examples: Evaluation of heat resistance of resin materials, quantification of inorganic filler content in resin materials, evaluation of crystal water in compounds *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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Strain measurement of power module package resin.
We would like to present the results of strain measurements conducted by attaching strain gauges and thermometers to the surfaces of power modules, both in the mounted state on a circuit board and in the unmounted state. In the mounted module, a slight delay in temperature change was observed, and correspondingly, the change in strain also appeared to be delayed. This is believed to be due to the slower transfer of heat to the module when it is mounted. At Aites, we conduct temperature cycle tests and temperature-humidity cycle tests, during which we can simultaneously measure the strain occurring in the mounted components. Please feel free to consult with us.
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The Relationship Between Materials and Heat: An Introduction to Thermal Analysis
When heat is applied to materials, various properties change. Thermal analysis is suitable for investigating such properties. Depending on the changes in the properties to be observed, different devices are used and combined as necessary. By understanding the various changes that occur when materials are subjected to heat, we can gain insights into how they will behave in practical applications. When combined with other chemical analyses, it is also possible to estimate relationships with molecular-level structures. For more details, please refer to the related materials. 【Analysis Equipment (Excerpt)】 <DSC (Differential Scanning Calorimeter)> ■ Changes observed: Heat flow (exothermic/endothermic) ■ Properties that can be determined: Melting point (freezing point), glass transition, crystallization, specific heat capacity ■ Applicable materials: Plastics, rubber, metals ■ Analysis examples: Measurement of the curing degree of thermosetting resins, measurement of the transformation temperature of shape memory alloys.
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Aites was established in 1993, originating from the quality assurance department of the IBM Japan Yasu office. Based on the technical expertise cultivated through cutting-edge defect analysis and reliability assurance of electronic components at the IBM Japan Yasu office, we have provided various products and services that support the development and manufacturing of semiconductors, displays, organic EL, solar cells, and electronic components to customers both domestically and internationally.