Observation of Conductive Particle Shapes in COG Implementation
Observing the conductive particles from the planar direction and the cross-sectional direction! A case study confirming the degree of deformation.
We will introduce the observation of the shape of conductive particles in COG implementation. ICs and liquid crystal panels are implemented using the COG method with ACF (anisotropic conductive film). A resin ball is used as the core, and a metal layer (such as nickel or gold) is deposited on its surface for conductivity. During connection, the particles deform appropriately to electrically connect the IC and the panel. To confirm the degree of particle deformation and the connection state, cross-sectional observations were conducted, revealing that the particle deformation amount was "medium," indicating an appropriate level of deformation. By examining the deformation of conductive particles from both the planar and cross-sectional directions, we can explore the correlation with display defects. Please feel free to contact us for any inquiries regarding panel-related defects. [Summary] - In implemented ICs, slight "warping" or "tilting" can cause differences in particle deformation between the edges and the center, potentially leading to display defects. - By examining the deformation of conductive particles from both the planar and cross-sectional directions, we can explore the correlation with display defects. *For more details, please refer to the PDF document or feel free to contact us.
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