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Power device failure location / Slice & View three-dimensional reconstruction

By reconstructing a three-dimensional image of the damaged area, observe the overall structure of the destroyed object!

We will introduce the three-dimensional reconstruction of failure locations using the Slice & View function of FIB-SEM. Continuous SEM images of the structure are obtained, and the resulting images are corrected for positional misalignment between SEM images and visualized in three dimensions using three-dimensional construction software (Avizo). By combining the position identification technology for cross-sectioning the failure location with the Slice & View function, it is possible to obtain continuous SEM images that retain the defective state and include information before and after the abnormal area. [Contents] ■ About Slice & View and three-dimensional reconstruction ■ Continuous SEM observation and three-dimensional reconstruction of failure locations identified by OBIRCH *For more details, please download the PDF or feel free to contact us.

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Total solution service for power devices

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Observation of diffusion layers in semiconductors using FIB-SEM.

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Cross beam FIB cross-sectional observation

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Announcement of the Introduction of FIB-SEM Helios 5 UC

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Failure analysis of power devices

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Power semiconductor analysis service

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Power device failure location / Slice & View three-dimensional reconstruction

OTHER

Specification verification and failure analysis through reliability testing.

TECHNICAL

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