Observation of CMOS image sensor cross-section by mechanical polishing.
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At our company, we created a cross-section of the CMOS image sensor component associated with VR goggles manufactured by Company A through mechanical polishing while keeping the component in its original state, and we conducted structural observations of the CMOS sensor component. During the observation of the sensor component structure and sensor surface, we removed the glass filter and observed the surface of the CMOS sensor, where it was noted that the arrangement of the color filters was in a configuration known as a Bayer filter. In addition to mechanical polishing, methods for creating cross-sections include processing with ion beams such as FIB and CP, as well as microtome methods. Consultations are free, so please feel free to contact us if you are unsure about the method for creating cross-sections. [Overview] ■ Observation of sensor component structure and sensor surface ■ Cross-section creation by mechanical polishing ■ SEM observation of the sensor chip surface layer *For more details, please download the PDF or feel free to contact us.
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Observation of tracking camera cross-section by mechanical grinding.
I would like to introduce "Cross-sectional observation of tracking camera using mechanical polishing." Regarding the structure of the tracking camera components, when viewed from above, the lens can be identified. Although it cannot be clearly seen in the X-ray image, the lens is incorporated into the convex part. Additionally, the cross-sectional structure is similar to that of an RGB sensor, featuring a back-illuminated CMOS structure. However, since color information is not necessary for the tracking camera, there is no color filter layer. A jagged uneven shape was observed on the surface of the photodiode.
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Observation of CMOS image sensor cross-section by mechanical polishing.
At our company, we created a cross-section of the CMOS image sensor component associated with A company's VR goggles through mechanical polishing while keeping the component intact, and we conducted structural observations of the CMOS sensor component. During the observation of the sensor component structure and sensor surface, we removed the glass filter and observed the CMOS sensor surface, where it was noted that the arrangement of the color filters was in a configuration known as a Bayer filter. In addition to mechanical polishing, methods for creating cross-sections include processing with ion beams such as FIB and CP, as well as microtome methods. Consultations are free, so please feel free to contact us if you are unsure about the cross-section creation method.
