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Specification verification and failure analysis through reliability testing.

Analysis can be performed on samples in various conditions thanks to our unique preprocessing technology!

Our company conducts consistent analysis from reliability testing to failure analysis. This allows us to confirm whether the samples meet the specifications, as well as to identify and observe the defective areas of failed samples. We propose and implement tests and analyses tailored to our customers' requests and objectives, assisting from cause investigation to problem resolution. Please feel free to contact us when you need our services. 【Analysis Flow】 ■ Specification confirmation of semiconductor devices through reliability testing ■ Identification of defective areas and observation of failure points using TEM ・ Identification of defective areas through EMS/OBIRCH analysis ・ Observation of failure points using TEM *For more details, please download the PDF or feel free to contact us.

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Specification verification and failure analysis through reliability testing.

TECHNICAL

Latch-up test contract service

PRODUCT

Total solutions for the reliability of semiconductor products.

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Total solution service for power devices

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Failure analysis of power devices

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ESD (HBM・MM) Testing Contract Service

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ESD (CDM) Testing Outsourcing Service

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Analysis of electronic components and materials using TEM.

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OBIRCH analysis of SiC devices using short-wavelength lasers.

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Backside light emission analysis of SiC devices

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Observation of the diffusion layer of SiC MOSFET using LV-SEM and EBIC methods.

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Power semiconductor analysis service

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HAST test of power devices

PRODUCT

ESD (CDM) Testing Outsourcing Service

PRODUCT

ESD (HBM・MM) Test Contract Service

PRODUCT

Announcement of the Introduction of FIB-SEM Helios 5 UC

PRODUCT

Reverse bias test of power devices (up to 2000V)

PRODUCT

IOL testing of discrete semiconductors

OTHER

Power device failure location / Slice & View three-dimensional reconstruction

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