Notice of Participation in SEMICON JAPAN 2025

マーポス

Our company will exhibit at "SEMICON JAPAN 2025," which will be held at Tokyo Big Sight starting from December 17, 2025 (Booth Number: E4727). At this exhibition, we will introduce semiconductor industry-specific applications and non-contact measuring instruments that contribute to the reliability of semiconductor manufacturing processes and the improvement of semiconductor performance, which are continuously evolving. We warmly invite you to visit our booth and see our offerings. <Main Exhibited Products> - Visual blade inspection system for dicing processes - Non-contact high-precision thin film measurement device (interferometry technology) - Non-contact high-precision surface shape measurement device (chromatic confocal technology) - Contact/non-contact thickness measurement gauge for controlling wafer thickness during processing (interferometry technology)

Date and time Wednesday, Dec 17, 2025 ～ Friday, Dec 19, 2025
10:00 AM ～ 05:00 PM
Advance registration is required for entry to this exhibition.
Capital Tokyo Big Sight (East Exhibition Hall)
Entry fee Free Admission to this exhibition requires prior registration.

Related product information

Dicing Machine Sensor "VBI (Blade Inspection System)"
Achieving reduced cycle time in chip manufacturing and high quality! Sensors for blade monitoring during wafer cutting.

For more details, please refer to the PDF document or feel free to contact us.
Optical Interference Measuring Instrument 'NCG'
Shorten cycle time! A versatile and easy-to-use optical interference measuring instrument designed for convenience.

【Other Features】 ■ Designed for versatility and ease of use ■ Each individual unit controlled by the machine can be connected through a network of sensors ■ Unique technology allows for the measurement of various components (highly reflective, rough surfaces, opaque materials, etc.) ■ Improved electronics unit enables the storage of continuous data during measurements, which can be used for post-process measurement details, quality control, and machine performance evaluation *For more details, please refer to the PDF document or feel free to contact us.
Chromatic confocal technology, non-contact measurement for thickness measurement.
It is possible to produce high-quality work without damaging delicate work and without destructive testing. It is a fully synchronized system that is resilient to variations in work and environment.

【Catalog Contents】 ■ Chromatic Confocal Principle ■ ChromaPoint Sensor Head ■ ChromaPoint Controller ■ ChromaLine Sensor Head ■ ChromaLine Controller ■ ChromaVision Camera ■ Application Examples (Various Distance, Thickness Measurement, Surface Roughness Measurement, Quality Control) ■ Glossary ■ Contact Us *For more details, please refer to the PDF document or feel free to contact us.