【TAIYO】Material Evaluation Services FPC・MPI・PTFE (Flexible Substrates) From high-frequency applications to various characteristics, we provide design, manufacturing, evaluation testing, and analysis reports for flexible printed circuit boards!

太洋テクノレックス本社　和歌山

We support the evaluation of high-frequency characteristics of materials under development. Our company has the know-how to handle everything from short-term prototypes to mass production of FPCs. We can provide optimal proposals tailored to the needs of material manufacturers, flexible printed circuit board manufacturers, and various equipment manufacturers. We assist in evaluating various characteristics of new materials that are being improved daily.

Material Evaluation Service (Flexible Printed Circuit Board)

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Material Evaluation Services: FPC, MPI, PTFE (Flexible Substrate)
From high-frequency applications to the design, manufacturing, evaluation testing, and analysis reports of flexible printed circuit boards with various characteristics!

- CCL conversion of the substrate (high-temperature press capability) - Simulation design to production (MSAP possible) - Evaluation measurement of test samples and report submission
High-frequency compatible FPC
Supports low transmission loss and impedance matching! There are various applications such as mobile electronic devices and IoT devices.

We are engaged in product development using various materials, including fluorine composite materials, MPI, and LCP. Collaboration for joint launches is also possible. We hope you will consider this.
Multilayer FPC (multilayer substrate, multilayer flexible printed circuit board)
We will manufacture multi-layer flexible printed circuit boards (3 to 6 layers) entirely from polyimide. Please look forward to our quick delivery response! (Multi-layer boards, FPC)

For more details, please refer to the PDF document or feel free to contact us.
[Presentation of Materials] Until FPC is completed...
[Basic Knowledge] The standard manufacturing process of Taiyo Industry, which has focused on small quantities of a wide variety of products, has been documented!

【Other Listings】 ■Development ■Etching ■Peeling ■Intermediate Inspection (AOI) ■Coverlay Processing ■Coverlay Temporary Bonding ■Coverlay Heat Press ■Printing (Silk) ■Surface Treatment (NiAu Plating) ■Sheet Bonding Processing (Reinforcement Plate) ■Reinforcement Plate Heat Press / Heat Roller ■Outline Processing (Mold) ■Outline Processing (Thomson Die) ■Final Inspection ■FPC Completion ■Component Mounting *For more details, please refer to the PDF document or feel free to contact us.