Implementation Technology Journal Electronics Implementation Technology Special Feature Article Published
We have received permission to publish the feature article that was included in the only domestic magazine specializing in implementation technology, "Electronics Implementation Technology." You can view it here.
Special Feature Content ■ Latest Trends in BGA Implementation Board Inspection Hybrid Inspection of Flying Probe Testers and JTAG Testing Andor System Support Co., Ltd. / Masayuki Taniguchi Takaya Co., Ltd. / Kohei Yanagida Overview BGA (Ball Grid Array) components are now used in all types of electronic devices, from consumer products to industrial equipment, and more recently, automotive devices. However, a reliable method for inspecting boards with BGA components (hereafter referred to as BGA implementation boards) has not been established. This is because every inspection method has its advantages and disadvantages, making it impossible to conduct a complete test using only one inspection method. Therefore, inspecting BGA implementation boards has become a challenge for many companies. In this article, we will introduce the latest technological trends in hybrid inspection that combines flying probe testers and JTAG (Joint Test Action Group) boundary scan as one solution to this issue. 1. Introduction 2. Inspection and Challenges of BGA Implementation Boards 3. Possibilities of Electrical Testing 4. In-Circuit Testing 5. JTAG Boundary Scan Testing 6. Hybrid Testing 7. Conclusion
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Benefits arising from mutual complementarity - Significant improvement in test coverage - Improvement in test throughput - Reduction in implementation area of digital circuit regions in board design (TP reduction) - More accurate fault diagnosis possible - Onboard programming or FPGA writing possible
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We will exhibit a corporate booth at the 39th Spring Conference of the Electronics Packaging Society. (Takushoku University, Bunkyo Campus)
Takaya Corporation will exhibit a corporate booth at the 39th Electronics Packaging Society Spring Conference, which will be held from March 11 (Tuesday) to March 13 (Thursday), 2025, at the Bunkyo Campus of Takushoku University. This conference is held annually under the management of the Japan Electronics Packaging Society, providing a platform for the presentation and exchange of the latest research and development results related to electronics packaging technology. Starting in 2023, a hybrid format combining in-person participation and online attendance has been implemented, attracting around 700 participants, primarily from academia and industry related to electronics packaging technology. When you visit, please be sure to stop by Takaya's booth. (Registration and payment of participation fees are required for attendance.)
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We will be exhibiting a poster at the 29th Okayama Research Park Research and Exhibition Presentation.
The "29th Okayama Research Park Research and Exhibition Presentation" will be held with the aim of presenting and disseminating research results from companies and institutions related to the "Okayama Research Park." We will have a poster exhibition on "Latest Trends in Hybrid Testing Systems Combining JTAG Testing and Flying Probe Testers." We invite companies, universities, and institutions interested in industry-academia-government collaboration to participate freely. Poster exhibition on research seeds (Industry-Academia Collaboration Model Booth + 8 fields) 《Fields》 ○ Precision Processing and Machinery ○ Materials Technology ○ Semiconductors ○ AI, IoT, Robotics ○ Medical, Bio, Food ○ Environment, Chemistry, Energy ○ Measurement, Inspection ○ Others ■ Organized by Okayama Prefecture, Okayama Prefectural Industrial Promotion Foundation ■ Supported by Okayama University, Okayama Prefectural University, Okayama University of Science, Kibi International University, Kawasaki Medical University, Kawasaki University of Medical Welfare, Shujitsu University and Shujitsu Junior College, Notre Dame Seishin University, Tsuyama National College of Technology, China Vocational Ability Development University, IPU International Pacific University, Okayama Research Park Incubation Center (ORIC)
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Feature article: "Latest Trends in BGA Assembly Board Inspection - Hybrid Testing with Flying Probe Testers and JTAG Testing" has ranked in the overall ranking of the Manufacturing Catalog.
Our company has ranked in the TOP 100 of the Ipros rankings. --- 【Aggregation Period】 August 16, 2023 - August 22, 2023 ━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━ ■Ipros Manufacturing ━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━ ★Catalog Ranking (out of 226,377 items) ￣￣￣￣￣￣￣￣￣￣￣￣￣￣￣￣￣￣ 44th place: Featured Article: Latest Trends in BGA Mounted Circuit Board Inspection - Hybrid Testing with Flying Probe Testers and JTAG Testing --- Thank you very much to everyone who viewed our content.
