Dual Side Flying Probe Tester APT-2600FD
A new innovation in substrate manufacturing. Achieving improvements in production efficiency and inspection accuracy!
The APT-2600FD is a next-generation dual-side flying probe tester that can perform combination testing with up to 6 probes using both upper and lower flying probes simultaneously. It improves test coverage while reducing the risk of product damage due to board flipping operations, significantly shortening inspection time. Equipped with a high-performance measurement system and a variety of features, it contributes to quality improvement from prototyping to mass production. We accept evaluation tests at our demonstration rooms in Okayama headquarters and Tokyo branch, where you can bring in your boards. A complete testing process is possible, including the creation of inspection programs, testing using actual boards, and summarizing evaluation results. *For more details, please feel free to contact us.*
basic information
In the electronic circuit board manufacturing industry, there is a growing demand for high performance and miniaturization, requiring the implementation of numerous components in limited spaces, and the demands for inspection accuracy and efficiency are increasing. Our latest model, the "APT-2400F/APT-2600FD series," is a groundbreaking inspection device developed to meet these industry needs, incorporating the highest level of technology in the industry. Key features of the new model: 1. Comprehensive design of all hardware and software in-house 2. Newly developed motor system and inspection probe mechanism 3. CMOS color camera with liquid lens 4. Remote camera 5. Automatic cleaner for inspection probes (optional) 6. Temperature sensor (optional) 7. Universal design 8. Versatile expansion features to meet a wide range of industry needs *For more details, please download the PDF materials or feel free to contact us.
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Our company's case study will be featured at "LINX DAYS 2025."
We are pleased to announce that Takaya Corporation's initiatives will be featured as a user case at the technology event "LINX DAYS 2025," hosted by Links Corporation. "LINX DAYS" is a technology event focused on cutting-edge technologies that support the advancement and automation of the manufacturing industry, including machine vision, industrial cameras, 3D sensors, robotics, and AI. It features presentations and case studies from leading companies both domestically and internationally, providing a valuable opportunity for many engineers, developers, and executives involved in manufacturing to engage with the latest industry trends and practical solutions. This time, we will be discussing the theme "Enhancing the Value of High-Speed Flying Probe Testers through HALCON Implementation," highlighting how our flying probe testers have evolved through the use of the image processing library "HALCON" and how we have achieved further precision and speed in the inspection process. We hope this information will be beneficial for those working on quality improvement and inspection automation in manufacturing environments.
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Our technical paper has been published in the October 2025 issue of "Inspection Technology."
In the October 2025 issue of the monthly magazine "Inspection Technology" (Nihon Kogyo Shuppan), an article about our latest technology has been published. Published article: "Latest Trends in Flying Probe Testers Equipped with New Technology" Author: Koki Yanagida, Industrial Equipment Division, Takaya Corporation This paper discusses the technological innovations of the latest flying probe testers designed to accommodate the high-speed and high-density printed circuit boards, as well as examples of the introduction of JTAG collaboration and ZERO impact technology.
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I have had a paper published in the Journal of the Institute of Electronics Packaging.
Our paper has been published in the "Journal of the Japan Institute of Electronics Packaging" (hereinafter referred to as "JIEP"), Vol. 28 No. 6 (September 2025). Published Paper "Development of an Ultra-High-Speed Flying Probe Tester for PCB Assembly Inspection" Author: Kouki Yanagida Paper Summary This paper reports on a new technology for the ultra-high-speed flying probe tester developed to address the challenges of high cost and difficulty in accessing fine components associated with traditional fixture-based in-circuit testing, proposing a new standard for next-generation high-density assembly board inspection.
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Our case study has been featured on the official website of i-PRO Co., Ltd.
Recently, a case study of Takaya Corporation has been published on the official website of i-PRO Co., Ltd. Our company has been addressing the challenge of developing and manufacturing a new type of flying probe tester by establishing a system to remotely understand the internal conditions of the equipment and expedite initial response. As a solution, we have introduced i-PRO's network cameras, achieving faster troubleshooting through real-time monitoring and enhancing quality control in the inspection process. In this case study, the background of the introduction, reasons for product selection, operational innovations, and the effects after implementation are presented from the perspective of the on-site personnel. Please take a look at the related link below.
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MES2025 35th Microelectronics Symposium Company Exhibition Information (Osaka University Nakanoshima Center)
Takaya Corporation will be exhibiting at the "MES2025 35th Microelectronics Symposium," which will be held for three days from September 3 (Wednesday) to September 5 (Friday), 2025, at the Osaka University Nakanoshima Center in Osaka City, Osaka Prefecture. Takaya plans to showcase a panel related to the APT series of flying probe testers. This symposium is a valuable opportunity to gather the latest research results and industry trends regarding electronic device packaging technology. We warmly invite you to visit Takaya's booth when you attend. We look forward to welcoming you.
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Founded in 1894 as a textile company, Takaya Textile expanded and established its electronics division in 1966, beginning the assembly of transistor radios. Currently, in addition to contract manufacturing services (EMS) related to electronic devices, the company actively manufactures and sells in-circuit testers (printed circuit board inspection devices), RFID-related equipment (technology that enables information exchange through short-range wireless communication from IC information tags), and engages in IT consulting and system solutions, among various electronics businesses both domestically and internationally. We will continue to evolve as a corporate group that contributes to the development of society, with textiles and electronics as our two pillars.