news list
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Our engineers have written about the cleaning technology required for sintering joining devices.
In the publication "Development of High-Heat-Resistant and High-Thermal-Conductive Materials for Next-Generation Power Devices - Thermal Management: Substrates, Joining, Sealing, and Cooling Technologies" by the Technical Information Association, our engineer has written about "Cleaning Techniques Required for Sintered Joining Devices." The text explains topics such as "The Formation and Residual Effects of Contamination in Sintered Joining Devices," "Selection of Cleaning Agents and Cleaning Methods," and "Analysis of Cleanliness After Cleaning." The book also provides a thorough explanation of Si, SiC, GaN, and gallium oxide, as well as the required characteristics in automotive environments and implementation examples. It details guidelines for designing TIMs and thermal sheets that balance "thermal characteristics" and "operational reliability." We highly recommend reading it.
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New seminar materials on "Evaluation Methods/Added Value in Flux Cleaning" have been added.
This document provides a detailed explanation of the evaluation methods and added value in flux cleaning. It introduces topics such as "cleanliness analysis in flux cleaning," "substances to be analyzed," "the impact of residual organic matter," and "the pathways and effects of ion contamination." Additionally, it includes an introduction to Zestron's company and examples of analytical methods. We encourage you to read it.
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We have newly added technical documentation on 'Ion Residues in Electronic Substrates and Their Analytical Methods'.
This document explains the analysis of ionic residues on electronic substrates that our company, as a cleaning agent manufacturer, has been working on. It includes explanations about ions and flux, as well as discussions on ion contamination measurement, ion chromatography, and scanning electron microscopy with energy dispersive X-ray spectroscopy. Additionally, it features case studies on the cleaning efficacy of surfactants. Please feel free to download and read it.
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Our engineers have written 'Ion Residues in Electronic Circuit Boards and Their Analytical Methods.'
In the technical book "Analysis Techniques for Foreign Substances and Sample Pretreatment, Interpretation of Results" published by the Technical Information Association, our engineers have written a section titled "Ion Residues on Electronic Substrates and Their Analytical Methods." It provides detailed descriptions of "What are Ion Residues," "Analysis of Ion Residues Remaining on Electronic Substrates," and "Analytical Case Studies - Cleaning Properties of Surfactants." This book serves as a valuable resource for addressing concerns such as difficulties in library searches or uncertainty about which analytical instruments to use, along with a wealth of analytical case studies.