Invitation to a Private Seminar on Semiconductor Resin Encapsulation

Kistler Japan G.K.合同会社 Head office
We are pleased to announce that Kistler Japan will be holding a private seminar on semiconductor resin encapsulation tailored to our customers' requests! [Title] "Visualization Solutions for the Interior of Molds" in Semiconductor Resin Encapsulation and IoT Technology [Date and Time] Weekdays from 10:00 AM to 5:00 PM (at the customer's preferred time) Available in both web and in-person formats [Duration] 1 to 1.5 hours [Application] Please let us know your preferences through the inquiry form on our company website. In this seminar, we will use CG videos to quantify the internal state of molds, often referred to as a black box, using the semiconductor encapsulation process as an example. We will provide detailed insights into improving major molding defects and enhancing production processes. [Effectiveness of Mold Interior Visualization] - Improvement of R&D - Homogenization during mass production - Visualization of filling balance for multiple cavities We will also propose sensing technologies and IoT solutions to improve molding defects using quartz piezoelectric sensors, which are effective for low-pressure measurements like epoxy transfer molding. The content is also applicable to injection molding cavity pressure monitoring, so interested customers are encouraged to contact us freely.

