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Invitation to a Private Seminar on Semiconductor Resin Encapsulation

Kistler Japan G.K.合同会社

Kistler Japan G.K.合同会社 Head office

We are pleased to announce that Kistler Japan will be holding a private seminar on semiconductor resin encapsulation tailored to our customers' requests! [Title] "Visualization Solutions for the Interior of Molds" in Semiconductor Resin Encapsulation and IoT Technology [Date and Time] Weekdays from 10:00 AM to 5:00 PM (at the customer's preferred time) Available in both web and in-person formats [Duration] 1 to 1.5 hours [Application] Please let us know your preferences through the inquiry form on our company website. In this seminar, we will use CG videos to quantify the internal state of molds, often referred to as a black box, using the semiconductor encapsulation process as an example. We will provide detailed insights into improving major molding defects and enhancing production processes. [Effectiveness of Mold Interior Visualization] - Improvement of R&D - Homogenization during mass production - Visualization of filling balance for multiple cavities We will also propose sensing technologies and IoT solutions to improve molding defects using quartz piezoelectric sensors, which are effective for low-pressure measurements like epoxy transfer molding. The content is also applicable to injection molding cavity pressure monitoring, so interested customers are encouraged to contact us freely.

High maturity resin encapsulation process for semiconductor manufacturing.
Visualizing the internal condition of the mold.

Related Links

Technology Page for "Visualization Solution Inside the Mold" for Semiconductor Resin Sealing
This is the technology page related to the content of this webinar.
Kistler Official Website Contact Form
Please feel free to let us know your inquiries or seminar applications through this contact form. Our sales representative will contact you within three business days.
Kistler Official Website
This is the official website of Kistler Japan, where various information is published, so please take a look.

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