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High-precision die bonder compatible with submicron technology. Compact tabletop model for prototyping, small-scale production, and research and development purposes.

【Main Specifications】 ○ Mounting Accuracy: 0.5μm ○ Optical Field of View Range: 0.54mm×0.43mm (minimum), 6.6mm×5.28mm (maximum) ○ θ Fine Adjustment Range: ±15° ○ Z Height Adjustment Range: 10mm ○ Working Area: 190mm×52mm ○ Load Range: 0.1N to 400N ○ Maximum Heating Temperature: 450℃ ○ Device Size: 660mm×610mm×640mm (main unit) ○ Compatible with formic acid gas processes *For more details, please refer to the catalog or feel free to contact us.

Fully automatic high-precision die bonding machine

【Main Specifications】 ○ Mounting Accuracy: ±0.3μm @ 3Sigma ○ Optical Field of View: 3.8mm x 2.7mm ○ Optical Field of View Resolution: 1μm/pix ○ Supported Chip Size (Minimum): 0.03mm x 0.03mm to 100mm x 100mm ○ θ Fine Adjustment: ±9°/ 3.5μrad ○ Z Movement / Accuracy: 10mm / 0.2μm ○ Y Movement / Accuracy: 150mm / 0.02μm ○ X Movement / Accuracy: 660mm / 0.02μm ○ Substrate Heating Temperature: 500℃ ○ Bonding Load Range: 0.05N to 1000N *For more details, please contact us or download the catalog.

The FINEPLACER sigma is the top model of semi-automatic flip chip bonders/die bonders, encompassing high precision and high functionality.

【Main Specifications】 ○ Mounting Accuracy: ±0.5μm ○ Optical Field of View Range: 3.8mm (expanded 83mm) x 2.7mm ○ Optical Field of View Resolution: 1μm/pix ○ Compatible Chip Size: 0.1mm x 0.1mm to 80mm x 100mm ○ Maximum Compatible Substrate Size: 300mm x 300mm ○ θ Adjustment Range: ±15° (±2° fine adjustment) ○ Z Height Adjustment Range: 10mm ○ Working Area: 440mm x 150mm ○ Maximum Bonding Load: 1000N ○ Maximum Heating Temperature: 450℃ ○ Compatible with Vacuum Chamber Process ● For more details, please contact us or download the catalog.