[Blog] Is rework a mature technology?

Here is how to determine which technology is suitable for your needs.

最終更新日 Jul 02, 2021

[Blog] Micro Assembly Day 2018

I learned about the tremendous efforts towards the reconstruction of the world-famous Berlin City Hall!

最終更新日 Jul 02, 2021

[Blog] LED Bonding

From manual work to automation... covering everything! Also offering excellent temperature profile management and optical high resolution.

最終更新日 Jul 02, 2021

[Blog] A Few "Little Things" Related to SMTAi 2018

We are able to quickly provide solutions for the newly emerging microLED market!

最終更新日 Jul 02, 2021

[Blog] Technology in Biomedical Applications

We are prepared to provide timely support that is often required in the healthcare market.

最終更新日 Jul 02, 2021

[Blog] Speed vs Throughput

Two important variables to consider when choosing a device are speed and throughput!

最終更新日 Jul 02, 2021

[Blog] Patience Due to COVID-19

While sincerely acknowledging this situation, we continue to improve our business!

最終更新日 Jul 02, 2021

[Blog] Now, let's start the demonstration!

Remote acceptance testing for the purchased equipment! Offering various virtual experiences.

最終更新日 Jul 02, 2021

High-precision flip chip bonder 'femto2'

Fully automatic high-precision die bonding machine

最終更新日 Nov 10, 2024

High-precision die bonder/flip chip bonder 'sigma'

The FINEPLACER sigma is the top model of semi-automatic flip chip bonders/die bonders, encompassing high precision and high functionality.

最終更新日 Jul 29, 2024

High-precision die bonder and flip chip bonder 'lambda2'

High-precision die bonder compatible with submicron technology. Compact tabletop model for prototyping, small-scale production, and research and development purposes.

最終更新日 Jul 29, 2024

Fully automatic high-precision die bonder "FINEPLACER femto2"

Demonstrates excellent high-precision mounting accuracy in mass production and prototype development. *Technical materials related to bonding are currently being distributed.

最終更新日 Oct 08, 2024

High-precision die bonder femto blu with a mounting accuracy of 2.0μm@3σ.

This is a high-precision die bonding machine with ultra-low load control, fully automatic operation, and compatibility with fine chips. *Technical materials are also available!

最終更新日 Jun 15, 2021