Example of analysis of compounds at the SAC solder and Ni pad interface.

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We will introduce an example of the analysis of compounds formed at the interface between Sn-Ag-Cu solder and NiP pads. At the interface of NiP pads and Sn-Ag-Cu solder, compounds such as (Ni,Cu)3Sn4 and (Cu,Ni)6Sn5 grow, and surface analysis using EDX shows the distribution of Ni, Cu, and Sn within these compounds. The EBSD method is a technique that analyzes based on the crystallographic information of the sample. By combining it with elemental analysis using EDX, it is possible to estimate the composition, and in some cases, it may be possible to analyze using crystallographic data for Ni3Sn4 and Cu6Sn5 as substitutes.

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Example of analysis of compounds at the SAC solder and Ni pad interface.
It is also possible to display various maps of each phase! Analysis is based on the information of the crystal structure possessed by the sample.

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■Mechanical polishing of the substrate bonding area + Chemical etching + Ion milling Observation using optical microscope and SEM ■Cross-section creation using FIB Observation using SEM
Total support service for cross-sectional grinding, processing, observation, and analysis.
We undertake contract processing and manufacturing of cross-sections of various parts and materials.

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Each part is carefully polished by hand, using an efficient process without waste!

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Surface mount electronic component cross-sectional observation service
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