Confirmation of chiplet package structure by mechanical polishing.
Cross-sectional samples were created using X-ray CT observation and mechanical polishing, and structural confirmation was conducted!
Regarding the chip mounted on the main circuit board of the VR goggles manufactured by Company A, upon visual observation, it was inferred that it has a chiplet structure with multiple chips integrated. To examine the structure in more detail, we created a cross-section using X-ray CT observation and mechanical polishing, and we will introduce the structural confirmation. *For detailed information, please refer to the attached PDF document. For more details, feel free to download the PDF or contact us.
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*You can view the detailed information in the attached PDF document. For more details, please download the PDF or feel free to contact us.*
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*You can view the detailed information in the attached PDF document. For more details, please download the PDF or feel free to contact us.*
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Aites was established in 1993, originating from the quality assurance department of the IBM Japan Yasu office. Based on the technical expertise cultivated through cutting-edge defect analysis and reliability assurance of electronic components at the IBM Japan Yasu office, we have provided various products and services that support the development and manufacturing of semiconductors, displays, organic EL, solar cells, and electronic components to customers both domestically and internationally.