Ultrasonic microscope observation of printed circuit boards.
Delamination inside the circuit board, which is not visible during visual inspection, can also be visualized!
At Aites Co., Ltd., we conduct ultrasonic microscope observation (transmission method) of printed circuit boards. In printed circuit boards, issues such as delamination (separation) can occur due to factors like storage environment, thermal and humidity stress, and defects in the manufacturing process, leading to the separation of internal layers of the board. The transmission method involves transmitting ultrasonic waves through the observation sample and converting the received ultrasonic waves into electrical signals for imaging. If there are voids such as delamination, the ultrasonic waves do not transmit, resulting in a black appearance in the image. 【Features】 - Effective for detecting delamination (separation) that is not visible through visual inspection due to internal defects in the board. - Ultrasonic waves are transmitted through the observation sample for imaging. - Areas with voids such as delamination appear black in the image. *For more details, please download the PDF or feel free to contact us.
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【Specifications (Transmission Method)】 ■Device Used: Nordson SONOSCAN D9600 ■Acoustic Lenses: 15, 25, 30, 50, 100 MHz ■Maximum Measurement Range: 314mm × 314mm *For more details, please download the PDF or feel free to contact us.
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[Observation Case] ■ Numerous black spots were confirmed in the ultrasonic microscope images, and upon cross-sectional observation, significant delamination was observed between the copper and the prepreg. ■ Many delaminations were also confirmed within the prepreg. *For more details, please download the PDF or feel free to contact us.
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Aites was established in 1993, originating from the quality assurance department of the IBM Japan Yasu office. Based on the technical expertise cultivated through cutting-edge defect analysis and reliability assurance of electronic components at the IBM Japan Yasu office, we have provided various products and services that support the development and manufacturing of semiconductors, displays, organic EL, solar cells, and electronic components to customers both domestically and internationally.