Observation of cross-sectional polishing of power modules.
For evaluations before and after reliability testing, as well as failure analysis due to severe thermal stress from power cycling!
We would like to introduce an example of cross-sectional observation of IGBT modules conducted by our company. Starting with the removal of the encapsulation gel, we perform extensive cross-section preparation to confirm the overall structure, as well as cross-sectional observations of fine structures such as solder joints and wire bonding interfaces. In extensive cross-sectional observations, we can grasp the overall structure and check for distortions in the entire module. Additionally, in fine structure cross-sectional observations, we can identify solder cracks, the growth and coarsening of intermetallic compounds, and issues such as lifting or fractures at wire bonding points. 【Features】 ■ Extensive cross-sectional observation - Ability to confirm the overall structure and distortions in the entire module ■ Fine structure cross-sectional observation - Ability to identify solder cracks, growth and coarsening of intermetallic compounds, and issues such as lifting or fractures at wire bonding points *For more details, please download the PDF or feel free to contact us.
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Aites was established in 1993, originating from the quality assurance department of the IBM Japan Yasu office. Based on the technical expertise cultivated through cutting-edge defect analysis and reliability assurance of electronic components at the IBM Japan Yasu office, we have provided various products and services that support the development and manufacturing of semiconductors, displays, organic EL, solar cells, and electronic components to customers both domestically and internationally.