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Affordable distance sensors for measuring film and coating thickness, as well as non-contact thickness measurement. Strong performance on slopes, achieving a distance direction resolution of 20nm!

【CHRocodile C】Low footprint probe-integrated type ■Features - Scan rate: 4 kHz - Light source: White LED light source - Measurement range: 5 types from 200 µm to 10 mm - Thickness measurement capable of measuring single layer and multiple layers (up to 3 layers) - Synchronous I/O function included - Interface: Ethernet/RS422 - HS (high sensitivity model) available - External box capable of capturing encoder and 2-channel analog input - External dimensions: 99 x 65 x 47 mm (without probe) - Weight: 440 g ■Features 【CHRocodile Mini】Space-saving separate probe type - Scan rate: 4 kHz (optional 10 kHz) - Light source: White LED light source - Measurement range: 2 types of 4 mm and 10 mm - Thickness measurement capable of measuring single layer and multiple layers (2 layers, optional 4 layers) - Synchronous I/O function included - Interface: Ethernet/RS422 - Mini+ model supports 2-channel analog output and 3-axis encoder input - External dimensions: 95 x 106 x 95 mm (controller) - Weight: 500 g (Mini+ is 550 g)

Optical sensor for measuring a wide range of thickness from 0.5 to 200 um. High-speed sampling at 5 kHz. Ideal for monitoring applications during processing.

【Other Features】 ■Measurement Range: 2μm to 1000μm (n=1) 0.5μm to 200μm (n=3.8, etc.) ■Resolution: Up to 3nm (n=1) ■Measurement Frequency: 5kHz ■Interface: Ethernet, RS422, Analog (2ch) *For more details, please refer to the PDF document or feel free to contact us.

Capable of measuring the total thickness of 12-inch wafers. High-speed measurement without the influence of vibrations, without a scanning stage. Suitable for online, offline, and wafer inspection applications.

For more details, please refer to the PDF document or feel free to contact us.

Non-contact optical thickness measurement. Applicable even for thickness measurements of semiconductor wafers where high precision is required.

【Other Features】 ■Measurement Range: 32μm to 3900μm (n=1, Linearity 1μm) 16μm to 1900μm (n=1, Linearity 0.35μm) ■Resolution: Up to 1nm (n=1) ■Measurement Frequency: 70kHz ■Interface: Ethernet, RS422, Analog (2ch) *For more details, please refer to the PDF document or feel free to contact us.

In addition to the conventional chromatic aberration confocal method and spectral interference method, a thickness measurement sensor utilizing laser heating has also emerged. It can measure the thickness of both transparent and opaque materials non-contactly.

**Principle** Our products mainly have three types of measurement principles. ■ Chromatic Aberration Confocal Primarily used for measuring surface shapes, but can also be utilized for measuring the thickness of transparent materials. While it is less accurate than spectral interference methods, it is recommended if you are looking for a cost-effective thickness measurement. ■ Spectral Interference Method Mainly used for thickness measurement. It enables high-precision measurements at the sub-micron level, leveraging the strengths of the spectral interference method. High-speed measurements necessary for in-situ, monitoring, or inline applications are possible. ■ Method Utilizing Laser Heating (Sensors from Enovasense) Heats the target object with a laser diode. It takes advantage of the fact that the speed of heat propagation differs depending on thickness. Using a proprietary algorithm, it detects the radiant heat from the target object and converts it into thickness. **Product Lineup** - Single Point Sensors Available in high-precision types as well as more affordable options under 1 million yen. - Line Sensors Using chromatic aberration confocal technology, it can perform full-area measurements in conjunction with an operating stage. - Area Scanner Sensors A type that can perform area scans with a two-axis galvanometer. There are also area scanners that do not require an operating stage and are unaffected by vibrations.

Non-contact line sensor CLS. High precision, high speed, and wide range 3D shape measurement. High tolerance for angles suitable for edges and slopes. Numerous achievements in wafer edge measurement.

【Application】 Non-contact 3D shape measurement is possible. It is also possible to replace contact methods with non-contact methods. ■ Home Appliances (Smartphones) - LCD glass - OLED mask inspection - Fine scratches and other surface defects - Wire bonding - AR glasses ■ Semiconductor Manufacturing Process - Wafer edge shape measurement - Wafer edge defect inspection - Wafer dicing groove appearance inspection - BGA inspection - IC package and circuit inspection ■ Automotive - Valve inspection - Car interior - Glass inspection - Inspection of airbag welding beads

The "CHRocodile 2 IT sensor" can measure the thickness of wafers during work processing.

【Other Features】 ■ Operators can achieve a high grinding rate, resulting in a significant reduction in processing time. ■ At the end of the process, the rate can be lowered again to maintain a smooth finish on the wafer. *For more details, please refer to the PDF document or feel free to contact us.

The "CHRocodile 2 DPS color aberration confocal sensor" is equipped with two independent measurement channels.

For more details, please refer to the PDF document or feel free to contact us.

Use an appropriate light source wavelength for doped wafers to accommodate challenging doped wafer thickness measurements.

【Other Features】 ■Measurement Range: 2DW1000 50μm–8000μm (n=1) 　　　　　　　2DW500 30μm–4000μm (n=1) 　　　　　　　2DW250 15μm–2000μm (n=1) ■Resolution: Up to 1nm (n=1) ■Interface: Ethernet, RS422, Analog (2ch) *For more details, please refer to the PDF document or feel free to contact us.

12" wafer full inspection accelerated, can also be used for full inspection of wafers.

■Overview - A system that integrates hardware (enclosure, optical thickness sensor, area scanner, electrical cabinet) and software (SEMI-compliant software). - High-speed measurement of up to 70kHz (measuring a 12" wafer in about 2 minutes at an XY pitch of 160um). - Z resolution of 1nm or more. ■Thickness Measurement Range The thickness measurement range varies depending on the optical sensor below. CHRocodile 2 IT DW 250: 15~1500um CHRocodile 2 IT DW 500: 26~2500um CHRocodile 2 IT DW 1000: 66~7200um *Thickness is the optical length. To convert to Si thickness, divide the above thickness by the refractive index of Si.