We will exhibit a corporate booth at the 39th Spring Conference of the Electronics Packaging Society. (Takushoku University, Bunkyo Campus)

TAKAYA Corporation

Takaya Corporation will exhibit a corporate booth at the 39th Electronics Packaging Society Spring Conference, which will be held from March 11 (Tuesday) to March 13 (Thursday), 2025, at the Bunkyo Campus of Takushoku University. This conference is held annually under the management of the Japan Electronics Packaging Society, providing a platform for the presentation and exchange of the latest research and development results related to electronics packaging technology. Starting in 2023, a hybrid format combining in-person participation and online attendance has been implemented, attracting around 700 participants, primarily from academia and industry related to electronics packaging technology. When you visit, please be sure to stop by Takaya's booth. (Registration and payment of participation fees are required for attendance.)

Date and time Tuesday, Mar 11, 2025 ～ Thursday, Mar 13, 2025
Capital Shizuoka University Bunkyo Campus & Online Hybrid Event 〒112-8585 3-4-14 Kohinata, Bunkyo-ku, Tokyo
Entry fee Charge

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