All products and services
1～30 item / All 54 items
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Battery bonding dedicated wire bonder "Asterion-EV"
Achieve multi-functional bonding solutions with a single unit! Specialized in bonding for batteries.
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Real-time process gas monitoring device
Simple structure! Eliminates interference between analysis targets and minimizes loss of measured components.
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Real-time AMC monitoring device
Optimized for use in labs, industrial sites, and mobile applications!
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High-precision multi-die bonder flip chip bonder
Supports the installation of multi-functional high-precision components! Compatible with applications requiring advanced load control and image recognition. [Demo units available for loan]
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Tabletop Semi-Automatic Die Bonder Flip Chip Bonder
Ideal for small-batch, multi-variety production and research and development! With simple operability, it is easy to mount chips and fine components. *Comprehensive catalog available.
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DAESHIN MC Corporation cleaning system *Demo unit available for rent
Introducing a cleaning system for caster wheels and shoe soles from cyclone suction mats, suitable for improving the cleanroom environment. *Video available.
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Ametek programmable power supply
AMETEK Bidirectional Programmable DC Power Supply Mi-BEAM Series for Charging and Discharging Tests of Large Capacity Batteries for EVs
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Diener Electronic's "Plasma Treatment Device"
We sell various plasma devices, including low-pressure types that can accommodate a wide range of materials and atmospheric pressure types that can be installed inline.
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X-ray inspection device (multi-focus X-ray transmission and CT system)
An X-ray fluoroscopy and CT device that combines world-class resolution with user-friendly operability, capable of supporting various applications.
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U.S. TECHNIC Corporation manufactured precious metal powder/volume resistivity measurement jig
Top-class manufacturing volume in the industry! Customization of products to meet customer needs is also possible!
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AMX Corporation Sintering Device
Sintering device equipped with a patented micro punch press. Capable of sintering dies of different heights and substrates of various shapes.
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Sanitary-compatible dispensing device
Leave the quantitative dispensing for food products to us!
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Aluminum wire bonder/ribbon bonder ASTERION
"Improving productivity, bond quality, and reliability" - Expanding the bonding area, equipped with advanced pattern recognition, and enhancing process control in wire bonding.
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Resistance welding electrode
Resistance welding electrode
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Pulse heat heater chip and heater tool
Heater chips and heater tools compatible with major manufacturer pulse heat power supplies.
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Resistance welding electrode (cylindrical type)
Resistance welding electrode (cylindrical type)
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Lead-free solder / low melting point solder / molding solder
Molding solder for semiconductor devices and microelectronics.
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Model 1200 Vacuum and Pressure Reflow Device
The Model 1200 tabletop reflow device is an ideal tabletop unit for process development and small-scale production of microelectronics packages.
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Moisture Absorbing Material
Moisture adsorbents/moisture getter materials optimal for high-end semiconductor and optical communication devices that require high reliability.
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STAYSTIK thermoplastic adhesive
Outgassing levels are extremely low! The perfect adhesive for improving reliability.
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Conductive paste/thick film paste/insulating paste for ceramic electronic components
We offer a variety of RoHS-compliant products, including thermistor paste, conductor paste, dielectric paste, and more.
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Custom-made manufacturing equipment and production line construction
Device development tailored to customer needs! Enabling the introduction of high-level production equipment.
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VPS Reflow Device
Achieve a stable temperature process! Capable of 3D implementation and accommodating three-dimensional structures!
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Reflow device compatible with high heat capacity and large devices.
A reflow device with high uniformity and low running costs.
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POWERCOAT paper substrate
Support for the realization of connected paper with printed electric circuits on paper, smart features, and integrated NFC.
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Model 5100 Vacuum and Pressure Reflow Device
Batch-type vacuum pressure reflow that supports next-generation processes and achieves voidless results.
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Wedge bonding tool cleaning service
Stable and high-quality wire bond process management! Achieve improved operating rates and high productivity!
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Aluminum wire/ribbon wire compatible wedge bonder PowerFusion
Wedge bonder equipped with a direct drive motion system and a high-performance image recognition system, achieving high productivity and reliability.
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Techno Alpha's "Reflow Oven"
We handle a variety of reflow devices that can achieve stable temperature processes.
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Area Laser Soldering (Solder/Reflow) Equipment
FR-4 not only allows for solder bonding to heat-resistant substrates, but also to substrates with lower heat resistance temperatures such as PC and PET. It is an innovative area laser device.
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