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◉ 【MiniLab-080】Flexible Thin Film Experimental Device

◉ 【MiniLab-080】Flexible Thin Film Experimental Device

◉ 【MiniLab-080】Flexible Thin Film Experimental Device

The ML-080, consisting of a D-type box chamber with a volume of 80 liters and dimensions of 400(W)x400(D)x570(H)mm, has a longer TS distance adjustment range by increasing the height of the chamber compared to the 060 model, which improves film uniformity during deposition on large-diameter substrates. It is a higher model than the ML-060, which can also add a load lock mechanism. Like the 060, it is compact yet supports a wide range of applications including resistance heating deposition (metal/insulator/organic materials), EB deposition, RF/DC compatible magnetron sputtering, dry etching, CVD, and annealing. - Resistance heating deposition source x up to 4 - Organic deposition source x up to 4 - Magnetron sputtering cathodes x 4 - Electron beam deposition - Maximum Φ8 inch heating stage (standard 500℃, Max 1000℃) - RF/DC etching system - CVD (thermal CVD, PECVD)

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