All products and services
1～22 item / All 22 items
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Chemical liquid scrub spin cleaning device
Complete various cleaning processes to spin drying in a single chamber. Space-saving design suitable for research and development as well as small lot production.
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1-chamber type liquid chemical spin scrub cleaning machine
Complete cleaning to spin drying in a single chamber. Space-saving design suitable for research and development as well as small lot production.
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Wafer edge mirror polishing device (Edge Polish)
Polishing equipment (Edge Polish) that performs mirror polishing, rough polishing, and cleaning using filtered water and pure water as the medium without slurry.
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Precision parts cleaning device (degreasing)
Degreasing cleaning device for HDD motor parts (HUB, case, etc.) Example configuration: detergent + ultrasonic (degreasing cleaning) → pure water rinse + ultrasonic → warm air drying → vacuum drying
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Si Nugget Cleaning Device
Si Nugget cleaning device with automatic transport using a dedicated basket, from chemical polishing, acid cutting, high-quality water washing to drying, improving cleaning efficiency through basket oscillation.
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300mm Cassette-less Cleaning System
Used in the chemical polishing process after final polishing / Batch processing of 50 pieces / Achieving high purity of 19nμm/5 pieces
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FOUP cleaning device
Cleaning difficult-to-wash uneven surfaces with high-pressure pulse jets! More stable cleaning results can be achieved compared to manual cleaning.
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FOSB cleaning device
Cleaning difficult-to-clean uneven surfaces with high-pressure pulse jets! More stable cleaning results can be achieved compared to manual cleaning.
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Box cleaning device
Cleaning difficult-to-wash uneven surfaces with high-pressure pulse jets! More stable cleaning results can be achieved compared to manual cleaning.
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Cassette box cleaning device
Cleaning difficult-to-clean uneven surfaces with high-pressure pulse jets! More stable cleaning results can be achieved compared to manual cleaning.
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High-pressure intermittent spray "DP-Gun"
For cleaning various masks, glass, and after wafer polishing! Capable of opening and closing the nozzle 30 times per second, it delivers repeated impacts with a small amount of water.
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High-pressure pulse jet DP-Gun for cleaning masks, glass, and wafers.
If the pressure is the same, the water usage is 1/3; if the flow rate is the same, the pressure is 3 times; with a lower flow rate, there are repeated impacts. For removing slurry after mask and glass cleaning wafer polishing.
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Dry Dispersion Device "Particle-Compatible Dispersion and Spreading Device"
This is a dry spraying device that disperses and uniformly scatters particles ranging from several micrometers to several hundred nanometers through frictional charging. It achieves stable spraying with charge amount feedback control!
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Dry Spreading Device "Desktop Type Simple Spreader"
This is a dry spraying device that disperses and uniformly scatters particles ranging from several micrometers to several hundred nanometers through frictional charging. It achieves stable spraying with charge amount feedback control!
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Dry Spreader Device "Dry Spacer Spreading Device"
This is a dispersion device that disperses and uniformly scatters particles ranging from several hundred nanometers to several tens of micrometers through frictional charging. It achieves stable dispersion with charge amount feedback control.
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Single Chamber Type "Wafer Multi-Purpose Spin Scrub Cleaning Device"
A space-saving cleaning device that removes foreign substances and metal contamination in a single chamber! It accommodates applications from mass production to research and development through a combination of cleaning methods.
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LT・SiC and other 2 to 6-inch small diameter wafer simultaneous chemical scrub cleaning device
A chemical cleaning device that enables the removal of contaminants, metal pollution, and transport and drying without touching the front and back surfaces of the workpiece! It also supports a combination with brush cleaning using chemicals.
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Dual-side simultaneous scrub cleaning device for small diameter wafers (LT, SiC, etc. 2 to 6 inches)
A scrub cleaning device that allows for transportation and drying without touching the front and back of the workpiece! In addition to simultaneous cleaning of the front, back, and sides with a unique mechanism, it also supports combinations with ultrasonic showers and more.
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Wafer cleaning device "Double-sided brush cleaning device (for research and development)"
It is possible to transport, wash, and dry without touching the front and back surfaces of the work.
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Wafer cleaning device "Double-sided scrub cleaning device (for research and development)"
It is possible to transport, wash, and dry without touching the front and back surfaces of the workpiece.
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Wafer cleaning device "Double-sided brush cleaning device (mass production type)"
It is possible to transport, wash, and dry without touching the front and back surfaces of the work.
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Space-saving type "Spin Cleaning Device (Multipurpose Cleaning Type)"
One-chamber multipurpose scrub cleaning. It is possible to remove foreign substances and metal contamination in one chamber! Space-saving, making it suitable for research and development.
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