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Breaking through the challenges of the semiconductor industry! The CADN amoeba consortium starting with small-scale prototypes.
Backed by the collaboration of 300 domestic companies, we can achieve 'prototyping from a few pieces,' which is impossible for major OSATs.
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Example 4: Advanced technology for millimeter-wave compatible three-layer RDL substrates and chip bonding.
Semiconductor implementation technology that achieves a 70GHz bandwidth. Completion of a complex 24-step process through collaboration among 15 companies.
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[Case 3] Shortest connection implementation solution for SOC + memory module
Overcoming the height difference between semiconductor chips! Innovative COC bonding with copper ball spacers.
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[Case 2] Micromachining Technology for Backside Illuminated X-ray Image Sensors
Maximizing the opening rate with 1 million corner hole formations. Challenging the limits of semiconductor wafer processing.
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[Case 1] Realization of high sensitivity using 3D implemented chiplet X-ray sensors.
Successfully achieved 3D stacking of heat-sensitive sensors and semiconductor LSIs at low temperatures with ultra-high-density implementation at 50µm intervals.
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"MONSTER PAC" semiconductor packaging technology that achieves low temperature and high precision.
Low-temperature bonding from 80℃ unlocks the potential of heat-sensitive devices.
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A new standard for outsourcing semiconductor packaging development called "OSRDA."
Flexible contract development that solves customers' "troubles."
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The explosive proliferation of IoT devices and the challenges of next-generation semiconductor implementation.
By 2030, it will reach 64 billion units. The evolution of hardware supporting the accelerating digital society.
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Revolutionizing Semiconductor Packaging! Connectec Japan's Challenge
Revitalizing Japan's manufacturing industry with the power to change and the power to connect.
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[Example of Problem Solving] Equipment Manufacturer
We will introduce examples of equipment development and low-temperature 80°C chip bonding to narrow-pitch PET substrates.
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[Example of Problem Solving] Material Manufacturer
Introducing examples of free-form wiring implemented using a jet dispenser.
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[Example of Problem Solving] Chip Manufacturer
We will introduce examples of implementing heat-resistant fragile chip mounting, low thermal stress mounting, and large chip mounting.
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[Example of Problem Solving] System and Set Manufacturers
Examples of narrow-pitch MEMS mounting on flexible substrates and flexible circuit board implementations.
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Core technology supporting OSRDA: FSNIP
Can be manufactured with small devices and in small area factories! Achieving an excellent method that does not cause alignment shifts.
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Core technology supporting OSRDA: MONSTER PAC(R)
Not only solving the issues of joining temperature, but also freeing from the thermal expansion and contraction of materials! Enabling high-precision implementation.
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Semiconductor manufacturing equipment "Desktop Flip Chip Bonder"
No clean room needed! A flip chip bonder that makes factory miniaturization possible.
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