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[Example of Problem Solving] Equipment Manufacturer
We will introduce examples of equipment development and low-temperature 80°C chip bonding to narrow-pitch PET substrates.
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[Example of Problem Solving] Material Manufacturer
Introducing examples of free-form wiring implemented using a jet dispenser.
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[Example of Problem Solving] Chip Manufacturer
We will introduce examples of implementing heat-resistant fragile chip mounting, low thermal stress mounting, and large chip mounting.
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[Example of Problem Solving] System and Set Manufacturers
Examples of narrow-pitch MEMS mounting on flexible substrates and flexible circuit board implementations.
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Core technology supporting OSRDA: FSNIP
Can be manufactured with small devices and in small area factories! Achieving an excellent method that does not cause alignment shifts.
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Core technology supporting OSRDA: MONSTER PAC(R)
Not only solving the issues of joining temperature, but also freeing from the thermal expansion and contraction of materials! Enabling high-precision implementation.
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Semiconductor manufacturing equipment "Desktop Flip Chip Bonder"
No clean room needed! A flip chip bonder that makes factory miniaturization possible.
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