受託製造
受託製造
量産をお客様の自社工場で行う場合は、量産立上げまでをご依頼いただき量産化に向けた実装技術の開発だけを弊社で行い、 その技術をお客様に導入する量産サポートも行っております。 開発から量産まですべてをご依頼いただく場合においてもパートナー企業を含めフレキシブルに対応いたします。 量産規模にはこだわらず、様々なお客様からの開発受託・製造受託に柔軟に対応しております。
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Revolutionizing Semiconductor Packaging! Connectec Japan's Challenge
Revitalizing Japan's manufacturing industry with the power to change and the power to connect.
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The explosive proliferation of IoT devices and the challenges of next-generation semiconductor implementation.
By 2030, it will reach 64 billion units. The evolution of hardware supporting the accelerating digital society.
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A new standard for outsourcing semiconductor packaging development called "OSRDA."
Flexible contract development that solves customers' "troubles."
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"MONSTER PAC" semiconductor packaging technology that achieves low temperature and high precision.
Low-temperature bonding from 80℃ unlocks the potential of heat-sensitive devices.
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[Case 1] Realization of high sensitivity using 3D implemented chiplet X-ray sensors.
Successfully achieved 3D stacking of heat-sensitive sensors and semiconductor LSIs at low temperatures with ultra-high-density implementation at 50µm intervals.
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[Case 2] Micromachining Technology for Backside Illuminated X-ray Image Sensors
Maximizing the opening rate with 1 million corner hole formations. Challenging the limits of semiconductor wafer processing.
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[Case 3] Shortest connection implementation solution for SOC + memory module
Overcoming the height difference between semiconductor chips! Innovative COC bonding with copper ball spacers.
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Example 4: Advanced technology for millimeter-wave compatible three-layer RDL substrates and chip bonding.
Semiconductor implementation technology that achieves a 70GHz bandwidth. Completion of a complex 24-step process through collaboration among 15 companies.
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Breaking through the challenges of the semiconductor industry! The CADN amoeba consortium starting with small-scale prototypes.
Backed by the collaboration of 300 domestic companies, we can achieve 'prototyping from a few pieces,' which is impossible for major OSATs.
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