[For AI/ML] NearStack Substrate Connector
Connector directly connected to the circuit board that supports high-speed processing of AI/ML.
In the AI/ML field, computational power is required to process vast amounts of data at high speeds. Particularly in advanced processing such as deep learning, the data transmission speed between chips significantly affects the overall performance of the system. Wiring through conventional PCBs can lead to unavoidable signal delays and attenuation, potentially becoming a bottleneck for high-speed processing. Our OCP-compliant NearStack Substrate connector addresses this challenge by directly outputting high-speed transmission signals from the chip without going through the PCB, using a 0.50mm SMT plug and a thin cable assembly. 【Use Cases】 - High-speed data transfer for AI/ML chipsets - High-performance computing systems - Data center infrastructure 【Benefits of Implementation】 - Increased signal transmission speed and reduced latency - Improved system performance - Space-saving and enhanced design flexibility
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【Features】 - Supports 56 Gbps PAM-4 / 112 Gbps PAM-4 - Direct chip-to-board wiring on board connectors - Direct placement of PCB plugs on the board surface 【Our Strengths】 Lester Corporation serves as an information platform for electronics, offering a variety of services including the handling of semiconductors and electronic components. To meet the demand for high-speed processing in the AI/ML field, we provide cutting-edge connector solutions to support our customers in solving their challenges. In our device business, we offer sales and technical support for semiconductors and electronic components, LSI design and development, and reliability testing contract services, providing multifaceted support for our customers' product development.
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Lester Corporation supports the manufacturing of electronics that underpin our daily lives through a variety of services, including the handling of semiconductors and electronic components. Additionally, as a system supplier for electronic devices, we propose optimal solutions across a wide range of fields such as broadcasting, video production, local governments, schools, and healthcare. Furthermore, amid growing concerns about global environmental issues like global warming, we contribute to reducing the environmental burden and realizing a sustainable society through business activities such as the deployment of mega-solar projects and the provision of energy management services.