Examples of semiconductor observation using mechanical polishing.

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In the methods for cross-section preparation in semiconductor structure observation and defect analysis, CP, FIB, and mechanical polishing are mentioned, each having its own advantages and disadvantages, making it necessary to consider which method to use. In recent years, CP and FIB have become more common, and it seems that the use of mechanically polished methods, which require technical skill, is decreasing. However, it is still not something to be dismissed. While there are merits and demerits, it is possible to achieve cross-section preparation with mechanical polishing that is on par with FIB and CP. At our company, based on years of accumulated know-how, we propose the most appropriate processing method according to the observation purpose, sample composition, and structure.

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Examples of semiconductor observation through mechanical polishing.
Cross-section preparation for structural observation and defect analysis of semiconductors! Cross-section preparation comparable to FIB and CP is possible.

For more details, please refer to the PDF document or feel free to contact us.
Cross-sectional observation of substrate-mounted components (1) to (6)
Introducing the "Observation Mode" of a chip capacitor (MLCC) under a microscope!

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Cross-sectional observation of substrate-mounted components.
Observations before and after reliability testing and cross-sectional observations! Here are examples of observations of various implemented components.

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[Data] Structural Analysis of MEMS Components
Comprehensive analysis of the structure of MEMS components using a combination of non-destructive and destructive methods!

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Total support service for cross-sectional grinding, processing, observation, and analysis.
We undertake contract processing and manufacturing of cross-sections of various parts and materials.

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[Information] Cross-section production method
We are publishing the main cross-section manufacturing methods, processing conditions, advantages & disadvantages, etc.!

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Total support service for LED.
We will thoroughly evaluate and verify the LED from all angles.

■LED Reliability Testing 　・Optical Property Evaluation - Corresponding to Ultraviolet and Visible Light Regions - 　　The optical property values of LED products can be utilized for product inspection and understanding quality status. 　・Electrical Property Evaluation 　　Understanding the electrical defects or degradation state of the LED. 　・High-Temperature Operation Testing / High-Temperature and High-Humidity Operation Testing 　　Voltage monitoring during testing operations is possible using In-Situ continuous measurement devices. 　・Reliability Testing 　　Conducting reliability testing evaluations considering the usage environment of the LED. 　・Lighting Test 　　Testing can be conducted from individual LED devices to 1200mm fluorescent tube sizes. 　・Non-Destructive Testing 　　Conducting transmission observation of the internal structure of the LED using X-rays. 　・ESD Testing 　　Two types: HBM (Human Body Model) and MM (Machine Model). ■LED Analysis and Evaluation 　・Isolation of LED Failure Modes 　　Identifying defective areas and proposing optimal analysis methods. 　・Emission Analysis with Forward and Reverse Bias 　　Detecting leakage points of the LED using various methods. 　・Back Surface Polishing and Emission Analysis of LED Elements 　　Analyzing the cause of leakage occurrence through cross-sectional observation of leakage points. 　・Structural Analysis Example of Orange LEDs 　　Analyzing the structure through cross-sectional SEM observation.
LED failure analysis
Applying advanced sample preparation techniques and failure analysis equipment for semiconductors! Investigating the causes of non-lighting and brightness degradation.

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Surface mount electronic component cross-sectional observation service
You can closely observe the solder joint condition of electronic components on the implementation board and the internal structure of the components!

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Cross-sectional polishing service for implementation parts and electronic components.
Each part is carefully polished by hand, using an efficient process without waste!

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Analysis of the assembly joints of the implemented components
By applying chemical etching, ion milling, and FIB processing to mechanical polishing, we will analyze various metal joints, starting with lead-free solder.

■Mechanical polishing of the substrate bonding area + Chemical etching + Ion milling Observation using optical microscope and SEM ■Cross-section creation using FIB Observation using SEM