Webinar (2/18): "Visualization Solutions for Mold Interiors" in Semiconductor Resin Encapsulation and IoT Technology
Kistler Japan G.K. Head office
In this webinar, we will use CG videos to quantify the internal state of molds, often referred to as a black box, using the semiconductor encapsulation process as an example. We will provide detailed insights into the know-how for improving major molding defects and enhancing production processes. Kistler's piezoelectric pressure sensors are highly advantageous and optimal for the conditions of semiconductor encapsulation. We will also propose sensing technologies to improve major molding defects using piezoelectric sensors effective for low-pressure measurements, such as in epoxy transfer molding. Please check the details through the link below and register using the registration form. https://info.kistler.com/ja-webinar-sealed-molding Additionally, it may be helpful to view the technical explanation page below in advance for better understanding. https://info.kistler.com/sealed-molding-ja The webinar will be held twice, but both dates will cover the same content. Please choose a date that is convenient for you. We look forward to the participation of many attendees.


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Date and time Thursday, Feb 18, 2021
10:30 AM ~ 11:30 AM
- Entry fee Free