【Construction Technology】 Contracted Electrostatic Prevention Functional Coating (Fluororesin-based, PEEK-based, etc.) 【Technical Features and Functions】 ■ Excellent Electrostatic Prevention and Conductive Properties Shuts out frictional charging and prevents electrostatic discharge (ESD) and the adhesion of foreign substances and fine particles (particles). ■ Elimination of Metal Touch and Shock Absorption Eliminates direct contact with metal and ceramic surfaces, reducing scratches and chipping on wafers. ■ Low Wear and High Weather Resistance Suppresses wear and dust generation associated with high-speed continuous transport, maintaining a clean surface condition for an extended period. 【Target Substrates and Applicable Parts】 ■ Various metals (SUS, aluminum, etc.), various ceramics (alumina, etc.) ■ Wafer transport hands (end effectors, blades, claw parts) for EFEM and vacuum transport robots. 【Re-coating Support】 ■ Even if the coating wears out after long-term use, it can be peeled off and re-applied (re-coating). Expensive hand substrates can be reused instead of being discarded. * Re-coating is not possible for ceramic parts.

Pass-e Coat

**Main Application Areas and Devices** - Semiconductor Front-End and Back-End: EFEM (Wafer Transfer Module), Vacuum Transfer Robots, Sorting Devices - Inspection and Measurement Processes: Wafer Appearance Inspection Devices, Laser Markers, Prober Device Transfer Hands - Clean Transfer: High-Speed Pick and Place Mechanism for Glass Substrates and Silicon Wafers **Case Study of Problem Solving** - Issue: Due to "metal touch" from aluminum and ceramic hands of the automatic transfer robot, small chipping and scratches on the backside of the wafers occurred at the wafer edge. Additionally, static electricity caused by transfer friction attracted tiny particles in the cleanroom, leading to electrostatic discharge (ESD) and reduced yield. - After Implementation: Anti-static functional coating was applied to the entire contact surface of the wafer transfer hand's tip. - Effects and Results: - Dramatic reduction in wafer scratches and chipping defects. - Elimination of static electricity, significantly reducing the risk of particle adhesion and electrostatic discharge. - Elimination of sticking to the hand, achieving high-speed and stable positioning transfer.