◉ 【MiniLab-060】Flexible Thin Film Experimental Device
◉ 【MiniLab-060】Flexible Thin Film Experimental Device
A semi-custom-made thin film experimental device that can be flexibly assembled according to your desired configuration, including deposition, sputtering, EB, and annealing modules. Possible combinations from the following deposition sources: - Resistance heating deposition source x up to 4 - Organic deposition source x up to 4 - Electron beam deposition - 2-inch magnetron sputtering cathodes x 4 [Main Specifications] - SUS304 60ℓ volume chamber 400x400x400mm - Pump: Turbo molecular pump, rotary pump (dry pump also available) - Vacuum exhaust: Automatic control of vacuum/vent - Metal film deposition: Up to 4 points - Organic film deposition: Up to 4 points - EB electron beam deposition source: 7cc crucible x 6 (or 4cc crucible x 8) - Φ2 to 4 inch magnetron sputtering cathodes x up to 4 - Process control: Manual/automatic multilayer film and simultaneous deposition, APC automatic control available (*optional) - Film thickness monitor: Quartz crystal oscillator sensor head x 2 - Utilities: Power supply 200V three-phase 13A, water cooling 3ℓ/min, N2 vent gas 0.1Mkpa - Other options: Substrate heating, cooling, substrate elevation/rotation, bias stage, dry pump, load lock
1～30 item / All 39 items
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Thin Film Experimental Device - "PRODUCTS GUIDE 2022"
Introduction of various experimental devices for research and development in semiconductors, electronic devices, fuel cells, displays, and thin film experiments.
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□■□【MiniLab-060】Flexible Thin Film Experimental Device□■□
A semi-custom-made thin film experimental device that can be assembled with the desired configuration for processes such as evaporation, sputtering, electron beam (EB) deposition, and annealing.
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□■□【MiniLab-026】Flexible Thin Film Experimental Device□■□
Compact and space-saving! Ideal for research and development. Flexible configuration for purposes such as deposition, sputtering, and annealing.
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MiniLab-026/090 Glove Box Thin Film Experiment Device
Compact and space-saving! Ideal for organic thin film development, all processes such as deposition, sputtering, and annealing can be seamlessly performed within the glove box.
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MiniLab Series Flexible Thin Film Experiment Device
Due to its modular embedded design, it is possible to flexibly assemble dedicated equipment according to the required film formation method. A compact thin-film experimental device that can accommodate various research applications.
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Magnetron Sputtering Cathode
High-efficiency magnetron sputtering cathode compatible with RF, DC, and pulse DC for depositing metals and insulators without impurities. It also excels in maintainability.
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【nanoPVD-S10A】Magnetron Sputtering Device
High-performance, cost-effective RF/DC magnetron sputtering system for research and development.
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◆nanoPVD-T15A◆ High-performance Organic and Metal Film Deposition Equipment
We have incorporated all the latest vacuum deposition technology into a compact benchtop-sized device that can effectively utilize limited lab space.
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◆ANNEAL◆ Wafer Annealing Equipment
Max 1000℃, maximum 3 systems for MFC, APC pressure control, compatible with 4" or 6" substrates, high vacuum annealing equipment (<5 × 10^-7 mbar)
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MiniLab-WCF Ultra-High Temperature Wafer Annealing Furnace 2000℃
6 to 8 inch ultra-high temperature wafer annealing equipment, a high-performance machine that widely accommodates various purposes from research and development to small-scale production.
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[Nanofurnace] BWS-NANO Thermal CVD Device
Hot Wall Type Thermal CVD Equipment: A compact, high-performance CVD device ideal for fundamental research.
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nanoCVD-8G Graphene Synthesis Device
◉ Short time: Easily conduct graphene synthesis experiments in just 30 minutes per batch. ◉ High-precision temperature and pressure control. ◉ Sophisticated software.
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Soft Etching Device [nanoETCH]
<30W Low power - Etching control precision 10mW Achieving damage-free and delicate etching processing.
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BH Series [High-Temperature Thin Film Experiment Substrate Heating Heater] Max 1800℃
This is a heater for thin film experiments such as PVD and CVD, featuring excellent uniformity, heating characteristics, and controllability. RF/DC bias specifications are also available.
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[SH High-Temperature Substrate Heater] For PVD, CVD Max 1100℃
CVD, PVD (evaporation, sputtering, etc.) high vacuum, ultra-high temperature plate heater for wafer and small chip heating with excellent uniformity and reproducibility.
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[Hot Stage] Ultra High Temperature Substrate Heating Stage Max 1800℃
An ultra-high temperature substrate heating stage that allows for substrate elevation, rotation, and RF/DC substrate bias all in one device! 'All-In-One' component.
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◾️Vacuum use 【CH ultra-high temperature cylindrical heater】 Max 1800℃ ◾️
Vacuum Ultra-High Temperature Cylindrical Heater Unit Maximum Temperature 1800°C (Graphite, C/C Composite)
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【Mini-BENCH】Ultra High Temperature Tabletop Experimental Furnace Max 2000℃
Tabletop small-sized experimental furnace - space-saving, with a maximum operating temperature of 2000°C! We also manufacture metal furnaces for reducing atmospheres.
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◆◇◆ Small Vertical Experimental Furnace for R&D TVF-110 ◆◇◆
Low-cost minimum necessary configuration (manual control) applicable as tubular furnace, diffusion furnace, and thermal CVD.
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□■□【MiniLab-080】Flexible Thin Film Experiment Device□■□
Flexible configuration available upon request for processes such as evaporation, sputtering, and EB. Adopts a tall chamber with a height of 570mm, contributing to improved uniformity during evaporation.
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□■□【MiniLab-090】Flexible Thin Film Experimental Device□■□
Storage-compatible glove box PVD flexible thin film experimental device, featuring a tall chamber with a height of 570mm, contributes to improved uniformity during deposition.
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◆Mini-BENCH-prism Semi-Automatic Ultra-High Temperature Experimental Furnace◆
Maximum operating temperature 2000℃ Semi-automatic control Ultra-high temperature experimental furnace (carbon furnace, tungsten metal furnace) Compact and space-saving experimental furnace
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Sputtering and deposition source hybrid thin film device [nanoPVD-ST15A]
Composite thin film experimental device nanoPVD-ST15A capable of mixed installation of vacuum deposition (metal and organic deposition sources) and sputtering cathodes.
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Vacuum Furnace "Mini-BENCH Ultra-High Temperature Tabletop Experimental Furnace"
Tabletop small-sized experimental furnace - space-saving with a maximum operating temperature of 2000℃! We also manufacture metal furnaces for reducing atmospheres.
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Vacuum Furnace "Mini-BENCH-prism Ultra-High Temperature Experimental Furnace"
Maximum operating temperature 2000℃ Semi-automatic control Ultra-high temperature experimental furnace (carbon furnace, tungsten metal furnace) Compact and space-saving experimental furnace
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Annealing furnace "MiniLab-WCF Ultra-High Temperature Wafer Annealing Furnace"
6 to 8 inch ultra-high temperature wafer annealing equipment, a high-performance machine that widely supports various purposes from research and development to small-scale production.
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Annealing furnace "ANNEAL wafer annealing device"
Max 1000℃, MFC maximum 3 systems, APC pressure control, compatible with 4" or 6" substrates, high vacuum annealing equipment (<5 × 10^-7 mbar)
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Sputtering device "MiniLab series"
Due to its modular embedded design, it is possible to flexibly assemble dedicated equipment according to the required film deposition method. A compact thin-film experimental device that can accommodate various research applications.
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Sputtering device "MiniLab-060"
A semi-custom-made thin film experimental device that can be assembled with the desired configuration for processes such as sputtering, EB (electron beam), and annealing.
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Vacuum Deposition Device "MiniLab-080"
Flexible configuration available upon request for methods such as deposition, sputtering, and EB. Adopts a tall chamber with a height of 570mm, contributing to improved uniformity during deposition.
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