Metal mask printing error substrate cleaning agent VIGON SC 202

Removes cream solder and SMT bond! As it is a water-based cleaning agent, it has no flash point and offers high safety.

VIGON SC 202 is a water-based cleaning agent that reliably removes cream solder and SMT bond in metal mask cleaning. It is also excellent for cleaning printed circuit boards with printing errors. It is recommended for use with spray cleaning machines and ultrasonic cleaning machines. 【Features】 ■ Effectively removes resin, adhesives, inks, solder paste, and flux residues ■ No flash point due to being a water-based cleaning agent, no explosion-proof specifications required ■ Can clean and rinse with a single solution ■ Free of surfactants ■ Contains no halogen compounds *For more details, please refer to the PDF document or feel free to contact us.

basic information

Solder paste, of course, has excellent cleaning properties for resin and ink as well. It has a wealth of experience in the electronics industry and is perfect for cleaning metal masks and dispenser nozzles in printed electronics. It is an environmentally safe water-based cleaning agent. There is no flash point, and it does not have an unpleasant odor, so there is no need for explosion-proof measures or other equipment considerations. Combining it with ultrasonic or spray methods is expected to further enhance cleaning performance. Since there are no liquid residues, it can be cleaned and rinsed with a single solution, but if drying is required, please consider using a drying device. For oil-resistant emulsions, we recommend ZESTRON VD. Depending on the compatibility requirements with materials, we recommend VIGON SC 200. *We offer free consultations on cleaning processes and cleaning tests, so please feel free to reach out to us.