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Water-based cleaning agent VIGON SC210 for SMT adhesives and metal masks

The VOC value is significantly below 20%! It can be used without explosion-proof equipment as there is no flash point.

The "VIGON SC 210" is a water-based cleaning agent specifically designed for cleaning SMT adhesives and metal masks. Based on MPC technology, it can reliably remove cream solder and SMT adhesives in a single process even at a low temperature of 18°C. Depending on the type of flux, it can also be used to clean misprinted circuit boards. Furthermore, it can remove adhesives from fixtures (especially dispenser nozzles) and is designed for spray cleaning and ultrasonic cleaning applications. 【Features】 - Stable and excellent cleaning performance in the temperature range of 18-40°C - Contains no surfactants, leaving no residue on circuit boards or inside equipment - Excellent material compatibility - Non-foaming, low odor, with no organic residue left in the rinsing process - Can also be used to remove adhesives from fixtures and dispenser nozzles *For more details, please refer to the PDF document or feel free to contact us.

Related Link - https://www.zestron.com/jp/product-information/pro…

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For more details, please refer to the PDF document or feel free to contact us.

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Applications/Examples of results

【Usage】 ■ Cream solder for metal masks / SMT bond *For more details, please refer to the PDF document or feel free to contact us.

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Water-based cleaning agent "VIGON SC 210"

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