Verification of the cleaning effect of formic acid reflux devices [Joint Research]
A detailed explanation of formic acid reflow! We will introduce cleaning know-how.
Formic acid reflow is a revolutionary joining process that allows solder bonding without flux by using a corresponding dedicated solder. By substituting the reducing action, one of the functions of flux, with formic acid, the amount of flux components can be significantly reduced. In the field of power devices, soldering using the formic acid reflow method is becoming more widespread due to its significant advantages in suppressing the occurrence of voids and enabling bonding at low temperatures. *For more details, you can view the related links. *The PDF document is a technical material that explains the cleaning technology for advanced electronic components.
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*You can view the detailed information through the related link. *The PDF document is a technical material that explains cleaning technology for advanced electronic components.
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*You can view the detailed information through the related links. *The PDF document is a technical material that explains the cleaning technology for advanced electronic components.
