Effects of morphological changes in flux residues after soldering on cleanability.
[Joint Research] Joint research on the effects of morphological changes on washability! Detailed explanations and images are presented.
The no-clean solder paste, which continues to evolve, generates significant heat in fields such as 5G devices and high-power devices for electric vehicles (EVs). As environmental burdens increase, it is necessary to pay attention to long-term changes even in stabilized flux residues. Recent market trends have led to the miniaturization of high-performance electronic devices, resulting in reduced distances between components. This, along with the demand for high-speed calculations and increased capacity, has resulted in high currents and voltages. Consequently, even slight flux residues that were previously not problematic can pose various risks, making cleaning necessary in high-reliability devices, even for no-clean flux residues. Together with Mr. Hiroki, who is developing high-performance solder paste, we conducted joint research on the morphological changes of flux residues after soldering and their impact on cleanability. *For more details, please refer to the related links. *The PDF document is a technical material explaining the evolution and challenges of power devices.
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*You can view the detailed information through the related link. *The PDF document is a technical material that explains the evolution and challenges of power devices.
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*You can view the detailed information through the related link. *The PDF document is a technical material that explains the evolution and challenges of power devices.
