Verification of the cleaning properties of Sn-Bi low melting point solder paste - Joint Research
Published solutions to challenges in the formation of metal salts (Bi salts)! We conducted joint verification of cleaning performance.
The Sn-Bi solder paste has various advantages, but in high-reliability fields, there are situations where cleaning is required, and one of the cleaning challenges is the formation of metal salts (Bi salts) after sintering. Bi salts can potentially cause migration issues, are difficult to dissolve in organic solvents, and make cleaning challenging. To address the issue of Bi salt formation, we conducted a joint verification of the cleaning properties of the low-melting-point Sn-Bi solder paste developed by Japan Superior Inc. *For more details, please refer to the related link. *The PDF document is a technical material that explains the evolution and challenges of power devices.
basic information
*You can view the detailed information through the related link. *The PDF document is a technical material that explains the evolution and challenges of power devices.
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*You can view the detailed information through the related link. *The PDF document is a technical material that explains the evolution and challenges of power devices.
