Verification of cleaning properties of solder paste for fine bonding in joint research with Nippon Superior Co., Ltd.
A fundamental transformation is required for cleaning methods and cleaning agents! Introducing cleaning know-how.
Advanced electronic devices, such as 5G-compatible communication equipment and control units for electric vehicles, are becoming smaller and thinner. Consequently, the development of solder paste for fine bonding is becoming increasingly active. These electronic devices require long-term high reliability, and there is a growing trend for the need for flux cleaning. Due to high-density mounting and the diversification of components, there is an increase in electronic devices with low stand-off. *For more details, please refer to the related links. *The PDF document is a technical resource that explains the cleaning technology required for sintering bonding.
basic information
*You can view the detailed information through the related link. *The PDF document is a technical material that explains the cleaning techniques required for sintering bonding.
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*For detailed information, please refer to the related links. *The PDF document is a technical material that explains the cleaning technology required for sintering bonding.
