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Equipped with process monitoring features! A green sheet cutter that accommodates everything from fine devices to 6mm thick materials.

【Specifications (Partial)】 ■ Cutting Method: Blade Push Cut (Optional: Ultrasonic Cut) ■ Target Workpiece ・ Material: Ceramic Green Sheet ・ Size: Maximum 225mm ・ Thickness: Maximum 6mm ・ Alignment Mark: Top/ Side ■ Equipment Size: W1100 x D1200 x H1600mm ■ Equipment Weight: 1000kg *For more details, please refer to the PDF document or feel free to contact us.

Compact and easy to deploy in production and development sites! Equipped with comprehensive process monitoring features.

【Specifications】 ■ Head Load: Load 10–500N ■ Head Type: Ultrasonic Head ■ Ultrasonic Frequency: Frequency 30kHz/40kHz (350/750W), 50kHz (250W) ■ Head Control: Digital control of load and ultrasound ■ Joining Monitoring: Standard profile reference software included ■ Recipe: Digital setting of joining conditions ■ Utilities ・ Air Source: 0.5MPa Dry Air ・ Power Supply: Main unit 100V10A, Oscillator 30kHz/40kHz: 100V5.2A/10A, 50kHz: 100V2.5A ■ Unit Size: W400 x D860 x H606mm (main unit) ■ Unit Weight: 150kg *For more details, please refer to the PDF document or feel free to contact us.

In addition to joining the same type of metal, welding enables the joining of different types of metals that is difficult to achieve!

【Specifications】 ■Head Load: Load 50–1800N ■Head Type: Ultrasonic Head ■Ultrasonic Frequency: Frequency 20kHz (3000/1250W), 30kHz (1250W) ■Head Control: Digital control of load and ultrasound ■Joining Monitoring: Standard profile reference software included ■Recipe: Digital setting of joining conditions ■Utilities ・Air Source: 0.5MPa Dry Air ・Power Supply: Main unit 200V10A, Oscillator 20kHz: 200V20A/8A, 30kHz: 200V8A ■Unit Size: W310 x D400 x H1908mm (Main unit) ■Unit Weight: 200kg *For more details, please refer to the PDF document or feel free to contact us.

Compatible with a wide range of applications! A multifunctional ultrasonic welding system integrated in a compact design.

【Specifications】 ■Bonding force: Load 1500N ■Head availability: Ultrasonic head ■Ultrasonic head: Choose from frequencies 20, 30kHz ■Ultrasonic output: Choose from 20kHz/3000, 1250W, 30kHz/1250W ■Head control: Digital control of load and ultrasound ■Bonding monitor: Standard profile reference software included ■Utility: Air pressure 0.5MPa Dry air Power supply Main unit / Single phase 85–264V 3A Oscillator / Three phase 200V 20A (at 3600W) ■Unit size: W193×D432×H282mm (main unit) ■Unit weight: 25kg (main unit) *For more details, please refer to the PDF document or feel free to contact us.

Ultrasonic cutter for cutting metal and resin materials with high-quality cross-sections.

【Specifications (Partial)】 ■Load: 150 to 1000N ■Frequency: Selectable from 20, 30, 40kHz ■Air source: 0.5MPa dry air ■Power supply: Single-phase 100V 15A ■Size: W900×D900×H1650mm (main unit) ■Options: Cut line confirmation camera *For more details, please refer to the PDF document or feel free to contact us.

Ideal for power devices! The ultrasonic head is highly rigid and compact!

【Specifications】 ■Head Load: Load 50–2000N ■Head Type: Ultrasonic Head ■Ultrasonic Frequency: Frequency 20kHz (3000/1250W), 30kHz (1250W) ■Head Control: Digital control of load and ultrasonic ■Joining Monitoring: Standard equipped with profile reference software ■Recipe: Digital setting of joining conditions ■Utility ・Air Source: 0.5MPa Dry Air ・Power Supply: Main unit 100V10A, Oscillator 20kHz: 200V20A/8A, 30kHz: 200V8A ■Unit Size: W900 x D900 x H1650mm (Main Unit) ■Unit Weight: 800kg *For more details, please refer to the PDF document or feel free to contact us.

This is a mass production ultrasonic metal joining device suitable for inverter production!

【Specifications】 ■Bonding force: Load 10–1000N ■Head height control: Repeated positioning accuracy ±25μm ■Head availability: Ultrasonic head ■Ultrasonic head: Frequency: 20kHz (can be easily switched to 30kHz or 40kHz) ■Ultrasonic output: 1200W ■Head control: Digital control of position, load, and ultrasound ■Bonding monitor: Standard profile reference software included ■Parallel adjustment: Three-point adjustment method ■Utility: Pneumatic source 0.5Mpa dry air, power supply three-phase 200V 25A ■Unit size: W1154×D1402×H1759mm ■Unit weight: 600kg *For more details, please download the PDF or feel free to contact us.

Achieving fully immersed UD tape manufacturing with a groundbreaking device size.

【Specifications】 ■Head force: Maximum load 1000N ■Process: Ultrasonic ■Carbon fiber: 12K, 24K ■Fiber roll: Width 252mm, Diameter 82.5–200mm, 1 piece ■Impregnating film: Film width 20–40mm, Diameter 92–320mm, 1 piece each for top and bottom ■UD tape roll: Width 320mm, Diameter 80–300mm ■Recipe: Condition setting Digital setting ■Option: UD tape width monitoring ■Utility: Air source 0.49MPa Dry air Power supply Single-phase 200V 20A ■Unit size: W2000×D800×H1700mm *For more details, please download the PDF or feel free to contact us.

Stable ultrasonic bonding technology using rigid clamps applicable to a wide range of applications.

For more details, please refer to the PDF document or feel free to contact us.

Ultrasonic cutting technology that achieves a clean cut surface without warping, bending, or dragging of composite materials.

This type of processing can be performed: ◎ Half-cut of film materials ◎ Cutting of complex shapes ◎ Smooth cutting of resin materials ◎ Vertical cutting of soft materials ◎ Thin and uniform slicing of soft materials *For more details, please refer to the materials. Feel free to contact us as well.

From research and development of next-generation secondary batteries to mass production. Providing ultrasonic joining devices/ultrasonic cutters!

For more details, please contact us.

There are advantages of ultrasonic bonding such as low resistance, short time, and room temperature joining!

For more details, please download the PDF or feel free to contact us.

Ultrasonic flip chip bonder capable of high-precision implementation with ultrasonic processes.

【Features】 ○ Development of advanced semiconductor packaging technology such as three-dimensional semiconductors using ultrasonic joining processes ○ High-precision alignment possible with IR transmission optical systems → Achieves alignment of X: ±1μm, Y: ±1μm ○ Equipped with high-precision positioning functions such as infrared optical systems → Simultaneous top and bottom field of view optical system (standard): Alignment accuracy of 5μm → IR optical system (optional): Alignment accuracy of ±1μm ○ Linear control of load in accordance with the increase in bonding area → Controls bonding by spreading from the bonding starting point at the center of the bump ○ Bonding control functions that respond to detailed condition settings during research and development → Monitoring software for bonding profiles is also standard equipment ● For more details, please contact us or download the catalog.

Widely usable from R&D to mass production automatic machine integration! Cutting metal foil with high-quality cross-sections.

【Application】 ■ Cutting of secondary battery electrode foil ■ Cutting of urethane rubber ■ Cutting of multilayer materials *For more details, please download the PDF or feel free to contact us.

Supports various processes with head exchange! Achieves a wide dynamic range through a low-friction pressurization mechanism.

For more details, please download the PDF or feel free to contact us.

Development of advanced semiconductor packaging technology such as three-dimensional semiconductors using ultrasonic bonding processes.

For more details, please download the PDF or feel free to contact us.

Power module and secondary battery circuit formation! Digital control of position, load, and ultrasound.

【Application】 ■IGBT Module ■Secondary Battery *For more details, please download the PDF or feel free to contact us.

Ultrasonic seam welding machine that transforms manufacturing with rotary ultrasonic welding.

【Features】 ○ Ideal for material lamination and material butt connections of power devices ○ Rotating horn joining unit that can be integrated into various devices ○ Enables large area joining by rotating the joining point ○ Allows continuous joining of continuous materials such as roll-shaped materials ○ Saves results such as ultrasonic power and load for each joining and displays them in graphs ● For more details, please contact us or download the catalog.

In the data settings, the pin connection position can be freely changed! It is possible to create heat sinks with a high degree of freedom.

【Application】 ■Cu Pin/DBC ■Cu Pin/DBA ■Al Hollow Pin/DBC ■Al Hollow Pin/DBA *For more details, please download the PDF or feel free to contact us.

Directly forming heat dissipation fins (pin fins/ribbon fins) on the back of the substrate achieves a high thermal conductivity (approximately 34 times that of TIM and about 7 times that of solder).

For details, please download the PDF document.

From R&D for power devices to mass production. Providing ultrasonic bonding equipment!

For more details, please refer to the PDF document or feel free to contact us.